| Date of Award | 18 Sept 2025 |
|---|---|
| Original language | English |
| Supervisor | Lennino Cacace (Supervisor 1), Pieter Kappelhof (Supervisor 2), Jo Spronck (Supervisor 2) & M.J. Boerkamp (External coach) |
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Subsurface Thermal Shock-wave Wafer Dicing Using a Concentric Laser Beam: Conceptual development of a pulsed near-infrared laser process for clean and accurate die separation
Student thesis: Master