Subsurface Thermal Shock-wave Wafer Dicing Using a Concentric Laser Beam
: Conceptual development of a pulsed near-infrared laser process for clean and accurate die separation

Student thesis: Master

Date of Award18 Sept 2025
Original languageEnglish
SupervisorLennino Cacace (Supervisor 1), Pieter Kappelhof (Supervisor 2), Jo Spronck (Supervisor 2) & M.J. Boerkamp (External coach)

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