Investigation of the reliability of electronic products under a mechanical dynamic load

: failure behaviour of solderjoints on multilayer printed circuit boards

  • W.G. Knoop

Student thesis: Master

Abstract

Date of Award30 Apr 1986
Original languageEnglish
SupervisorDick H. van Campen (Supervisor 1) & A. (Bram) de Kraker (Supervisor 2)

Cite this

Investigation of the reliability of electronic products under a mechanical dynamic load: failure behaviour of solderjoints on multilayer printed circuit boards
Knoop, W. G. (Author). 30 Apr 1986

Student thesis: Master