Xetal-Pro : an ultra-low energy and high throughput SIMD processor

Y. He, Y. Pu, S. Moreno Londono, R.P. Kleihorst, A.A. Abbo, H. Corporaal

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

28 Citations (Scopus)
39 Downloads (Pure)

Abstract

This paper presents Xetal-Pro SIMD processor, which is based on Xetal-II, one of the most computational-efficient (in terms of GOPS/Watt) processors available today. Xetal-Pro supports ultra wide VDD scaling from nominal supply to the sub-threshold region. Although aggressive VDD scaling causes severe throughput degradation, this can be compensated by the nature of massive parallelism in the Xetal family. The predecessor of Xetal-Pro, Xetal-II, includes a large on-chip frame memory (FM), which cannot operate reliably at ultra low voltage. Therefore we investigate both different FM realizations and memory organization alternatives. We propose a hybrid memory architecture which reduces the non-local memory traffic and enables further VDD scaling. Compared to Xetal-II operating at nominal voltage, we could gain more than 10× energy reduction while still delivering a sufficiently high throughput of 0.69 GOPS (counting multiply and add operations only). This work gives a new insight to the design of ultra-low energy SIMD processors, which are suitable for portable streaming applications.
Original languageEnglish
Title of host publicationProceedings of the 47th ACM/EEE int. conference on design automation DAC'10
Pages543-548
Publication statusPublished - 2010
Eventconference; DAC 2010, 2010-06-13; 2010-06-16, Anaheim, CA, USA -
Duration: 13 Jun 201016 Jun 2010

Conference

Conferenceconference; DAC 2010, 2010-06-13; 2010-06-16, Anaheim, CA, USA
Period13/06/1016/06/10
OtherDAC 2010, Anaheim, USA

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    He, Y., Pu, Y., Moreno Londono, S., Kleihorst, R. P., Abbo, A. A., & Corporaal, H. (2010). Xetal-Pro : an ultra-low energy and high throughput SIMD processor. In Proceedings of the 47th ACM/EEE int. conference on design automation DAC'10 (pp. 543-548)