Wireless millimeter-wave backplane for microwave phased arrays using bond-wire antennas

U. Johannsen, A.B. Smolders, M. Westeinde, van 't, R. Kemenade, B.B. Adela

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)
8 Downloads (Pure)

Abstract

Wireless interconnects are an interesting alternative for conventional hard-wired solutions and have already been proposed in literature. We propose to also use them to replace the traditional hard-wired backplane of wide-band phased-array systems with digital beamforming. For this, bond-wire antennas (BWAs) can be used, since they combine high performance with low cost. Moreover, they can be directly bonded on the transceiver integrated circuits (ICs). A computationally efficient model is introduced to compute the coupling between BWAs, which can be used in mainstream IC design tools and libraries. The accuracy is confirmed by measurements of fabricated prototypes. The results of our analysis show that a 60 GHz, 5 Gb/s, wireless backplane is already feasible for phased-arrays operating at C-band.
Original languageEnglish
Title of host publicationEuCAP 2014 - The 8th European Conference on Antennas and Propagation, to be held at the World Forum in The Hague, The Netherlands, on 6-11 April 2014.
Pages2713-2716
DOIs
Publication statusPublished - 2014
Event8th European Conference on Antennas and Propagation (EuCAP 2014) - The Hague, Netherlands
Duration: 6 Apr 201411 Apr 2014
Conference number: 8
http://www.eucap2014.org/

Conference

Conference8th European Conference on Antennas and Propagation (EuCAP 2014)
Abbreviated titleEuCAP 2014
Country/TerritoryNetherlands
CityThe Hague
Period6/04/1411/04/14
Internet address

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