Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

Simone Cardarelli; Nicola Calabretta; Ripalta Stabile; Kevin Williams; Xiao Luo; Jan Mink

doi:10.1109/ECTC.2018.00172

Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

Simone Cardarelli, Nicola Calabretta, Ripalta Stabile, Kevin Williams, Xiao Luo, Jan Mink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

8 Downloads (Pure)

Abstract

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

Original language	English
Title of host publication	Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
Publisher	Institute of Electrical and Electronics Engineers
Pages	1124-1129
Number of pages	6
Volume	2018-May
ISBN (Print)	9781538649985
DOIs	https://doi.org/10.1109/ECTC.2018.00172
Publication status	Published - 7 Aug 2018
Event	68th IEEE Electronic Components and Technology Conference, (ECTC 2018) - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018 https://www.merckgroup.com/en/events/ectc-2018.html

Conference

Conference	68th IEEE Electronic Components and Technology Conference, (ECTC 2018)
Abbreviated title	ECTC2018
Country/Territory	United States
City	San Diego
Period	29/05/18 → 1/06/18
Internet address	https://www.merckgroup.com/en/events/ectc-2018.html

Keywords

Bimorph piezoelectric actuators
Fiber-chip coupling
Optoelectronic packaging

Access to Document

10.1109/ECTC.2018.00172

Cite this

Cardarelli, S., Calabretta, N., Stabile, R., Williams, K., Luo, X., & Mink, J. (2018). Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (Vol. 2018-May, pp. 1124-1129). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2018.00172

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title = "Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators",

abstract = "A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.",

keywords = "Bimorph piezoelectric actuators, Fiber-chip coupling, Optoelectronic packaging",

author = "Simone Cardarelli and Nicola Calabretta and Ripalta Stabile and Kevin Williams and Xiao Luo and Jan Mink",

year = "2018",

month = aug,

day = "7",

doi = "10.1109/ECTC.2018.00172",

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volume = "2018-May",

pages = "1124--1129",

booktitle = "Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "68th IEEE Electronic Components and Technology Conference, (ECTC 2018), ECTC2018 ; Conference date: 29-05-2018 Through 01-06-2018",

url = "https://www.merckgroup.com/en/events/ectc-2018.html",

}

Cardarelli, S , Calabretta, N , Stabile, R , Williams, K, Luo, X & Mink, J 2018, Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators. in Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. vol. 2018-May, Institute of Electrical and Electronics Engineers, pp. 1124-1129, 68th IEEE Electronic Components and Technology Conference, (ECTC 2018), San Diego, California, United States, 29/05/18. https://doi.org/10.1109/ECTC.2018.00172

Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators. / Cardarelli, Simone ; Calabretta, Nicola ; Stabile, Ripalta et al.
Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Vol. 2018-May Institute of Electrical and Electronics Engineers, 2018. p. 1124-1129.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

AU - Cardarelli, Simone

AU - Calabretta, Nicola

AU - Stabile, Ripalta

AU - Williams, Kevin

AU - Luo, Xiao

AU - Mink, Jan

PY - 2018/8/7

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N2 - A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

AB - A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

KW - Bimorph piezoelectric actuators

KW - Fiber-chip coupling

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VL - 2018-May

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BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018

PB - Institute of Electrical and Electronics Engineers

T2 - 68th IEEE Electronic Components and Technology Conference, (ECTC 2018)

Y2 - 29 May 2018 through 1 June 2018

ER -

Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

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Keywords

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