Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

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Abstract

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers
Pages1124-1129
Number of pages6
Volume2018-May
ISBN (Print)9781538649985
DOIs
Publication statusPublished - 7 Aug 2018
Event68th IEEE Electronic Components and Technology Conference, (ECTC 2018) - San Diego, United States
Duration: 29 May 20181 Jun 2018
https://www.merckgroup.com/en/events/ectc-2018.html

Conference

Conference68th IEEE Electronic Components and Technology Conference, (ECTC 2018)
Abbreviated titleECTC2018
CountryUnited States
CitySan Diego
Period29/05/181/06/18
Internet address

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Keywords

  • Bimorph piezoelectric actuators
  • Fiber-chip coupling
  • Optoelectronic packaging

Cite this

Cardarelli, S., Calabretta, N., Stabile, R., Williams, K., Luo, X., & Mink, J. (2018). Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (Vol. 2018-May, pp. 1124-1129). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2018.00172