Abstract
Ill-V semiconductors like GaAs can be wet-chemically
etched by three mechanisms: electrochemically with an external
voltage source, electrochemically using an oxidizing agent (elec
troless), and chemically with a reactive compound. In some cases
the etching process only proceeds when the semiconductor is
exposed to light. The etch rate depends on the relative reaction rate
at the semiconductor surface and the mass transfer in the solution.
Other important factors are the effect of the crystal planes, the
orientation of a mask with respect to these planes, and the electrical
contact with other materials. Wet-chemical etching of Ill-V semi
conductors can be used on a large scale for various applications,
including the detection of crystallographic defects, the fabrication
of special profiles and the selective dissolution of closely related
materials in multilayer structures.
| Original language | English |
|---|---|
| Pages (from-to) | 61-74 |
| Journal | Philips Technical Review |
| Volume | 44 |
| Issue number | 3 |
| Publication status | Published - 1988 |