Wafer-to-order allocation in semiconductor back-end production

Patrick C. Deenen, Jelle Adan, Joep Stokkermans, Ivo J.B.F. Adan, Alp Akcay

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)
3 Downloads (Pure)


This paper discusses the development of an efficient algorithm that minimizes overproduction in the allocation of wafers to customer orders prior to assembly at a semiconductor production facility. This study is motivated by and tested at Nexperia’s assembly and test facilities, but its potential applications extend to many manufacturers in the semiconductor industry. Inspired by the classic bin covering problem, the wafer allocation problem is formulated as an integer linear program (ILP). A novel heuristic is proposed, referred to as the multi-start swap algorithm, which is compared to current practice, other existing heuristics and benchmarked with a commercial optimization solver. Experiments with real-world data sets show that the proposed solution method significantly outperforms current practice and other existing heuristics, and that the overall performance is generally close to optimal. Furthermore, some data processing steps and
heuristics are presented to make the ILP applicable to real-world applications.
Original languageEnglish
Title of host publicationWSC 2019- 2019 Winter Simulation Conference
EditorsN. Mustafee, K.-H.G. Bae, S. Lazarova-Molnar, M. Rabe, C. Szabo, P. Haas, Y.-J. Son
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages12
ISBN (Electronic)978-1-7281-3283-9
Publication statusPublished - Dec 2019
Event2019 Winter Simulation Conference, WSC 2019 - National Harbor, MD, USA, National Harbor, United States
Duration: 8 Dec 201911 Dec 2019


Conference2019 Winter Simulation Conference, WSC 2019
Abbreviated titleWSC2019
Country/TerritoryUnited States
CityNational Harbor
Internet address


Dive into the research topics of 'Wafer-to-order allocation in semiconductor back-end production'. Together they form a unique fingerprint.

Cite this