Wafer scale technique for interconnecting vertically stacked dies

P. Duan (Inventor), E. Smalbrugge (Inventor), O. Raz (Inventor), H.J.S. Dorren (Inventor)

Research output: PatentPatent publication

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Abstract

A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die on top of a first die, heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound, using lithography, from a top surface of the first die to a top surface of the second die, heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die top surface and the second die top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die top surface and the second die top surface.
Original languageEnglish
Patent numberWO2013064592
Priority date4/11/11
Publication statusPublished - 10 May 2013

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