Wafer exchange simulation

J.J. Nelisse, Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Software Technology (ST)

    Research output: ThesisPd Eng Thesis

    451 Downloads (Pure)

    Abstract

    ASML invents and develops complex technology for high-tech lithography, metrology and software solutions for the semiconductor industry. The technology consists of complex hardware that is controlled by complex software. For the key drivers, throughput, imaging, and overlay, testing the software is crucial. It also ensures availability, reliability, and robustness. Testing this software ranges from using the real hardware to simulators. Testing on real hardware is a challenge because of scarcity, testing dangerous situations etc. Hence it is important to improve the functionality of simulators. One such simulator is the Wafer Flow Simulator (WFS) that simulates the flow of a wafer in the Wafer Handling (WH) subsystem. The WH receives the wafer from the outside world and loads it to the Wafer Stages (WS) subsystem, which positions the wafer for measuring and exposing. The Wafer Exchange (WEX) specifies the protocol for transferring the wafer between the WH and WS. Currently the testing of the WEX software is executed after integration of these subsystems in the real hardware. This project provides an extension to the WFS to enable testing of the integrated software of the two subsystems in a software only environment, which is widely available and relatively cheap. The solution direction is to extend the WFS to describe and simulate the WS hardware required to execute the WEX. The result is that the WEX soft-ware can be tested before deploying the software to the real hardware, hence saving valuable machine time and increasing test coverage.
    Original languageEnglish
    Awarding Institution
    Supervisors/Advisors
    • den Hartog, Jerry I., Supervisor
    • Lobo, E.M.X., External supervisor
    • Nagy, I., External supervisor, External person
    Award date1 Oct 2014
    Place of PublicationEindhoven
    Publisher
    Print ISBNs978-90-444-1322-9
    Publication statusPublished - 1 Oct 2014

    Bibliographical note

    Eindverslag.

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