VDD ramp testing for rf circuits

J. Pineda de Gyvez; G. Gronthoud; R. Amine

doi:10.1109/TEST.2003.1270893

VDD ramp testing for rf circuits

J. Pineda de Gyvez, G. Gronthoud, R. Amine

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

37 Citations (Scopus)

313 Downloads (Pure)

Abstract

We present industrial results of a quiescent current testing technique suitable for RF testing. The operational method consists of ramping the power supply and of observing the corresponding quiescent current signatures. When the power supply is swept, all transistors are forced into various regions of operation. This has as advantage that the detection of faults is done for multiple supply voltages and corresponding quiescent currents, enhancing in this form the detectability of faults. We found that this method of structural testing yields fault coverage results comparable to functional RF tests making it a potential and attractive technique for production wafer testing due to its low cost, low testing times and low frequency requirements.

Original language	English
Title of host publication	Proceedings of the International Test Conference, 2003, ITC 2003, September 30 - October 2, 2003
Place of Publication	New York
Publisher	Institute of Electrical and Electronics Engineers
Pages	651-658
Volume	1
ISBN (Print)	0-7803-8106-8
DOIs	https://doi.org/10.1109/TEST.2003.1270893
Publication status	Published - 2003

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title = "VDD ramp testing for rf circuits",

abstract = "We present industrial results of a quiescent current testing technique suitable for RF testing. The operational method consists of ramping the power supply and of observing the corresponding quiescent current signatures. When the power supply is swept, all transistors are forced into various regions of operation. This has as advantage that the detection of faults is done for multiple supply voltages and corresponding quiescent currents, enhancing in this form the detectability of faults. We found that this method of structural testing yields fault coverage results comparable to functional RF tests making it a potential and attractive technique for production wafer testing due to its low cost, low testing times and low frequency requirements.",

author = "{Pineda de Gyvez}, J. and G. Gronthoud and R. Amine",

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VDD ramp testing for rf circuits. / Pineda de Gyvez, J.; Gronthoud, G.; Amine, R.

Proceedings of the International Test Conference, 2003, ITC 2003, September 30 - October 2, 2003. Vol. 1 New York : Institute of Electrical and Electronics Engineers, 2003. p. 651-658.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - VDD ramp testing for rf circuits

AU - Pineda de Gyvez, J.

AU - Gronthoud, G.

AU - Amine, R.

PY - 2003

Y1 - 2003

N2 - We present industrial results of a quiescent current testing technique suitable for RF testing. The operational method consists of ramping the power supply and of observing the corresponding quiescent current signatures. When the power supply is swept, all transistors are forced into various regions of operation. This has as advantage that the detection of faults is done for multiple supply voltages and corresponding quiescent currents, enhancing in this form the detectability of faults. We found that this method of structural testing yields fault coverage results comparable to functional RF tests making it a potential and attractive technique for production wafer testing due to its low cost, low testing times and low frequency requirements.

AB - We present industrial results of a quiescent current testing technique suitable for RF testing. The operational method consists of ramping the power supply and of observing the corresponding quiescent current signatures. When the power supply is swept, all transistors are forced into various regions of operation. This has as advantage that the detection of faults is done for multiple supply voltages and corresponding quiescent currents, enhancing in this form the detectability of faults. We found that this method of structural testing yields fault coverage results comparable to functional RF tests making it a potential and attractive technique for production wafer testing due to its low cost, low testing times and low frequency requirements.

U2 - 10.1109/TEST.2003.1270893

DO - 10.1109/TEST.2003.1270893

M3 - Conference contribution

SN - 0-7803-8106-8

VL - 1

SP - 651

EP - 658

BT - Proceedings of the International Test Conference, 2003, ITC 2003, September 30 - October 2, 2003

PB - Institute of Electrical and Electronics Engineers

CY - New York

ER -

VDD ramp testing for rf circuits

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