Ultra thin DVS-BCB adhesive bonding of III-V wafers dies and multiple dies to a patterned silicon-on-insulator substrate

S. Keyvaninia, M. Muneeb, S. Stankovic, P.J. Veldhoven, van, D. Thourhout, Van, G.C. Roelkens

Research output: Contribution to journal › Article › Academic › peer-review

143 Citations (Scopus)
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