Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

G. Roelkens; D. Thourhout, Van; I. Christiaens; R.G.F. Baets; M.K. Smit

Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

G. Roelkens
, D. Thourhout, Van
, I. Christiaens
, R.G.F. Baets
, M.K. Smit

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

This paper describes a novel way to integrate active III-V devices and SOI passive devices by bonding a III-V film on top of a processed SOI waveguide substrate using a 200nm thick Benzocyclobutene (BCB) bonding layer.

Original language	English
Title of host publication	12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005
Editors	S. Valette
Pages	250-253
Publication status	Published - 2005
Event	12th European Conference on Integrated Optics (ECIO 2005) - Grenoble, France Duration: 6 Apr 2005 → 8 Apr 2005 Conference number: 12

Conference

Conference	12th European Conference on Integrated Optics (ECIO 2005)
Abbreviated title	ECIO 2005
Country/Territory	France
City	Grenoble
Period	6/04/05 → 8/04/05
Other

Cite this

@inproceedings{1ca89622aca84b3aa89b26f671707ea6,

title = "Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components",

abstract = "This paper describes a novel way to integrate active III-V devices and SOI passive devices by bonding a III-V film on top of a processed SOI waveguide substrate using a 200nm thick Benzocyclobutene (BCB) bonding layer.",

author = "G. Roelkens and \{Thourhout, Van\}, D. and I. Christiaens and R.G.F. Baets and M.K. Smit",

year = "2005",

language = "English",

pages = "250--253",

editor = "S. Valette",

booktitle = "12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005",

note = "12th European Conference on Integrated Optics (ECIO 2005), ECIO 2005 ; Conference date: 06-04-2005 Through 08-04-2005",

}

Roelkens, G, Thourhout, Van, D, Christiaens, I, Baets, RGF & Smit, MK 2005, Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components. in S Valette (ed.), 12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005. pp. 250-253, 12th European Conference on Integrated Optics (ECIO 2005), Grenoble, France, 6/04/05.

Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components. / Roelkens, G.; Thourhout, Van, D.; Christiaens, I. et al.
12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005. ed. / S. Valette. 2005. p. 250-253.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

AU - Roelkens, G.

AU - Thourhout, Van, D.

AU - Christiaens, I.

AU - Baets, R.G.F.

AU - Smit, M.K.

N1 - Conference code: 12

PY - 2005

Y1 - 2005

N2 - This paper describes a novel way to integrate active III-V devices and SOI passive devices by bonding a III-V film on top of a processed SOI waveguide substrate using a 200nm thick Benzocyclobutene (BCB) bonding layer.

AB - This paper describes a novel way to integrate active III-V devices and SOI passive devices by bonding a III-V film on top of a processed SOI waveguide substrate using a 200nm thick Benzocyclobutene (BCB) bonding layer.

M3 - Conference contribution

SP - 250

EP - 253

BT - 12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005

A2 - Valette, S.

T2 - 12th European Conference on Integrated Optics (ECIO 2005)

Y2 - 6 April 2005 through 8 April 2005

ER -

Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

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