Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

G. Roelkens, D. Thourhout, Van, I. Christiaens, R.G.F. Baets, M.K. Smit

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Abstract

This paper describes a novel way to integrate active III-V devices and SOI passive devices by bonding a III-V film on top of a processed SOI waveguide substrate using a 200nm thick Benzocyclobutene (BCB) bonding layer.
Original languageEnglish
Title of host publication12th European Conference on Integrated Optics (ECIO'05), Grenoble, April 6-8, 2005
EditorsS. Valette
Pages250-253
Publication statusPublished - 2005
Event12th European Conference on Integrated Optics (ECIO 2005) - Grenoble, France
Duration: 6 Apr 20058 Apr 2005
Conference number: 12

Conference

Conference12th European Conference on Integrated Optics (ECIO 2005)
Abbreviated titleECIO 2005
CountryFrance
CityGrenoble
Period6/04/058/04/05
Other

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