Abstract
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.
Original language | English |
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Article number | 277 |
Number of pages | 13 |
Journal | Micromachines |
Volume | 8 |
Issue number | 9 |
DOIs | |
Publication status | Published - 13 Sep 2017 |
Keywords
- Stretchable electronics
- Ultra-stretchability
- CMOS
- Size-effects
- Miniature interconnects
- Microfabrication
- Freestanding interconnects
- Extreme stretchability
- Microelectronics
- High-density Microelectronics
- Soft electronics
- Soft robotics
- Flexible electronics
- Balloon catheter
- Small-scale testing
- Complementary metal-oxide semiconductor (CMOS) processing
- Miniaturized interconnects
- Mechanical size-effects