Transmitter PIC for THz applications based on generic integration technology

F.M. Soares, J. Kreissl, M. Theurer, E. Bitincka, T. Goebel, M. Moehrle, N. Grote

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
6 Downloads (Pure)

Abstract

A generic InP based monolithic photonic integration platform is introduced that is capable of simultaneously incorporating transmitter, receiver and passive-optical functionalities. On this basis, an integrated transmitter component for THz applications has been implemented.
Original languageEnglish
Title of host publicationThe 25th International Conference on Indium Phosphide and Related Materials (IPRM), 19-23 May 2013, Kobe
Place of PublicationKobe
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Print)978-1-4673-6131-6
DOIs
Publication statusPublished - 2013
Event25th International Conference on Indium Phosphide and Related Materials (IPRM 2013) - Kobe, Japan
Duration: 19 May 201323 May 2013
Conference number: 25

Conference

Conference25th International Conference on Indium Phosphide and Related Materials (IPRM 2013)
Abbreviated titleIPRM 2013
Country/TerritoryJapan
CityKobe
Period19/05/1323/05/13
Other25th International Conference on Indium Phosphide and Related materials (IPRM)

Fingerprint

Dive into the research topics of 'Transmitter PIC for THz applications based on generic integration technology'. Together they form a unique fingerprint.

Cite this