Transfer moulding of reactive materials: application to encapsulation of integrated circuits

Research output: ThesisEngD Thesis

260 Downloads (Pure)
Original languageEnglish
Supervisors/Advisors
  • Meijer, Han, Supervisor
  • Peters, Gerrit W.M., Supervisor
Award date1 Jan 1992
Place of PublicationEindhoven
Publisher
Print ISBNs90-5282-201-8
Publication statusPublished - 1992

Bibliographical note

Eindverslag
WFW 1992.098

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