Transfer moulding of reactive materials: application to encapsulation of integrated circuits

A.B. Spoelstra, Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Computational Mechanics

Research output: Thesis › EngD Thesis

252 Downloads (Pure)

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution
Supervisors/Advisors	Meijer, Han, Supervisor Peters, Gerrit W.M., Supervisor
Award date	1 Jan 1992
Place of Publication	Eindhoven
Publisher	Technische Universiteit Eindhoven
Print ISBNs	90-5282-201-8
Publication status	Published - 1992

Eindverslag
WFW 1992.098

Access to Document

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title = "Transfer moulding of reactive materials: application to encapsulation of integrated circuits",

author = "A.B. Spoelstra and {Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Computational Mechanics}",

note = "Eindverslag WFW 1992.098",

year = "1992",

language = "English",

isbn = "90-5282-201-8",

publisher = "Technische Universiteit Eindhoven",

type = "EngD Thesis",

}

TY - THES

T1 - Transfer moulding of reactive materials

T2 - application to encapsulation of integrated circuits

AU - Spoelstra, A.B.

AU - Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Computational Mechanics

N1 - Eindverslag WFW 1992.098

PY - 1992

Y1 - 1992

M3 - EngD Thesis

SN - 90-5282-201-8

PB - Technische Universiteit Eindhoven

CY - Eindhoven

ER -