Transfer moulding of reactive materials: application to encapsulation of integrated circuits

A.B. Spoelstra, Technische Universiteit Eindhoven (TUE). Stan Ackermans Instituut. Computational Mechanics

    Research output: ThesisEngD Thesis

    209 Downloads (Pure)
    Original languageEnglish
    QualificationDoctor of Philosophy
    Awarding Institution
    • Meijer, Han, Supervisor
    • Peters, Gerrit W.M., Supervisor
    Award date1 Jan 1992
    Place of PublicationEindhoven
    Print ISBNs90-5282-201-8
    Publication statusPublished - 1992

    Bibliographical note

    WFW 1992.098

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