Abstract
A passive W-band 19-channel spatial power splitter/combiner is presented, for the applications in grid amplifiers design. The design employs a linear array of chip-to-air-filled waveguide contactless connections, and are directly integrated within a single-layer. The meta-material-based gap waveguide is used; it enables a low-loss low-profile solution. The quasi-optical beamformer gives rise to a parallel-plate planar waveguide field which excites an array of contactless chip-to-waveguide transitions via step-tapered ridge gap waveguides. The other beamformer restores the field distribution (after amplification) and excites a wave going towards the waveguide output. Furthermore, the gap waveguide technology isolates the amplifiers from one another and provides a packaging solution in a single unit. The simulated return loss of the back-to-back structure is larger than 12 dB, while the insertion loss is smaller than 1.2 dB over the entire W-band (75–110 GHz)
Original language | English |
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Title of host publication | 2017 International Symposium on Antennas and Propagation, ISAP 2017 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 1-2 |
Number of pages | 2 |
ISBN (Electronic) | 978-1-5386-0465-6 |
ISBN (Print) | 978-1-5386-0466-3 |
DOIs | |
Publication status | Published - 21 Dec 2017 |
Event | 2017 International Symposium on Antennas and Propagation (ISAP 2017) - Phuket, Thailand Duration: 30 Oct 2017 → 2 Nov 2017 Conference number: 22 http://www.isap2017.org/ |
Conference
Conference | 2017 International Symposium on Antennas and Propagation (ISAP 2017) |
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Abbreviated title | ISAP 2017 |
Country/Territory | Thailand |
City | Phuket |
Period | 30/10/17 → 2/11/17 |
Internet address |
Keywords
- Optical waveguides, Waveguide transitions, Planar waveguides, System-on-chip, Packaging
- spatial power combining
- electromagnetic packaging
- Waveguide transition
- integration
- gap waveguide technology