Thermomechanical multiscale modelling of substrates

R. L.J.M. Ubachs; O. van der Sluis; W.D. van Driel; G. Q. Zhang

doi:10.1109/ESIME.2007.359937

Thermomechanical multiscale modelling of substrates

R. L.J.M. Ubachs, O. van der Sluis, W.D. van Driel, G. Q. Zhang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.

Original language	English
Title of host publication	2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	8
ISBN (Print)	1-4244-1105-X
DOIs	https://doi.org/10.1109/ESIME.2007.359937
Publication status	Published - 27 Nov 2007
Event	EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom Duration: 16 Apr 2007 → 18 Apr 2007

Conference

Conference	EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Country/Territory	United Kingdom
City	London
Period	16/04/07 → 18/04/07

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10.1109/ESIME.2007.359937

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Ubachs, R. L. J. M., van der Sluis, O., van Driel, W. D., & Zhang, G. Q. (2007). Thermomechanical multiscale modelling of substrates. In 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 Article 4201134 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2007.359937

@inproceedings{b606877f64d64fc4b385851c9cf943dd,

title = "Thermomechanical multiscale modelling of substrates",

abstract = "For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.",

author = "Ubachs, {R. L.J.M.} and {van der Sluis}, O. and {van Driel}, W.D. and Zhang, {G. Q.}",

year = "2007",

month = nov,

day = "27",

doi = "10.1109/ESIME.2007.359937",

language = "English",

isbn = "1-4244-1105-X",

booktitle = "2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 ; Conference date: 16-04-2007 Through 18-04-2007",

}

Ubachs, RLJM, van der Sluis, O, van Driel, WD & Zhang, GQ 2007, Thermomechanical multiscale modelling of substrates. in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007., 4201134, Institute of Electrical and Electronics Engineers, Piscataway, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007, London, United Kingdom, 16/04/07. https://doi.org/10.1109/ESIME.2007.359937

Thermomechanical multiscale modelling of substrates. / Ubachs, R. L.J.M.; van der Sluis, O.; van Driel, W.D. et al.
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. Piscataway: Institute of Electrical and Electronics Engineers, 2007. 4201134.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - Thermomechanical multiscale modelling of substrates

AU - Ubachs, R. L.J.M.

AU - van der Sluis, O.

AU - van Driel, W.D.

AU - Zhang, G. Q.

PY - 2007/11/27

Y1 - 2007/11/27

N2 - For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.

AB - For the thermomechanical analysis of multilayer substrates, detailed FE is not feasible. To capture all features, the number of elements necessary would lead to extreme computational loads. To overcome this, an elementwise homogenization method utilizing multiple representative volume elements is presented. Employing a global-local step it is still possible to obtain accurate values for local quantities of interest. The approach is demonstrated for thermal and mechanical problems. For the mechanical case the procedure is validated by a confrontation with experimental results showing the ability of the technique to indicate potential problem areas using the global/homogenized step and predict failure sites using the local step.

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DO - 10.1109/ESIME.2007.359937

M3 - Conference contribution

AN - SCOPUS:36349035178

SN - 1-4244-1105-X

BT - 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Y2 - 16 April 2007 through 18 April 2007

ER -

Thermomechanical multiscale modelling of substrates

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