Thermo-mechanical effects in majorana type quantum devices

A.W.J. Gielen; F.O. Valega Mackenzie

doi:10.1109/EuroSimE.2015.7103169

Thermo-mechanical effects in majorana type quantum devices

A.W.J. Gielen, F.O. Valega Mackenzie

Dynamics and Control

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

We have developed a multi-scale model, consisting of an atomistic model in LAMMPS of an InSb nanowire, and a continuum model in COMSOL of a socalled Majorana research device, to study the effects of thermo-mechanical deformations during the cool down from room temperature to the operating temperature of about 50 mK. For the simulation of the InSb nano-wire suitable potentials were implemented in LAMMPS. The simulation results of the nano-wire show size dependent Young's moduli and gradients in the radial lattice spacing during uniaxial straining. The materials properties that were derived from the atomistic model, were introduced in the continuum model. Cool down of the device from room temperature to it's operating temperature introduced significant deformation. However, the stresses in the system are moderate and no fracture or damage is expected. Still, deformation of the device will induce shifts in band gap behavior of the device. Band gap shifts using a simple approximation are estimated to be about 34%.

Original language	English
Title of host publication	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	9
ISBN (Print)	9781479999507
DOIs	https://doi.org/10.1109/EuroSimE.2015.7103169
Publication status	Published - 6 May 2015
Event	16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015) - Budapest, Hungary Duration: 19 Apr 2015 → 22 Apr 2015 Conference number: 16 http://www.eurosime.org/b15.htm

Conference

Conference	16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015)
Abbreviated title	EuroSimE 2015
Country/Territory	Hungary
City	Budapest
Period	19/04/15 → 22/04/15
Other
Internet address	http://www.eurosime.org/b15.htm

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10.1109/EuroSimE.2015.7103169

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Gielen, A. W. J., & Mackenzie, F. O. V. (2015). Thermo-mechanical effects in majorana type quantum devices. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [7103169] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2015.7103169

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abstract = "We have developed a multi-scale model, consisting of an atomistic model in LAMMPS of an InSb nanowire, and a continuum model in COMSOL of a socalled Majorana research device, to study the effects of thermo-mechanical deformations during the cool down from room temperature to the operating temperature of about 50 mK. For the simulation of the InSb nano-wire suitable potentials were implemented in LAMMPS. The simulation results of the nano-wire show size dependent Young's moduli and gradients in the radial lattice spacing during uniaxial straining. The materials properties that were derived from the atomistic model, were introduced in the continuum model. Cool down of the device from room temperature to it's operating temperature introduced significant deformation. However, the stresses in the system are moderate and no fracture or damage is expected. Still, deformation of the device will induce shifts in band gap behavior of the device. Band gap shifts using a simple approximation are estimated to be about 34%.",

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Gielen, AWJ & Mackenzie, FOV 2015, Thermo-mechanical effects in majorana type quantum devices. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015., 7103169, Institute of Electrical and Electronics Engineers, 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015), Budapest, Hungary, 19/04/15. https://doi.org/10.1109/EuroSimE.2015.7103169

Thermo-mechanical effects in majorana type quantum devices. / Gielen, A.W.J.; Mackenzie, F.O. Valega.

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 2015. 7103169.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - We have developed a multi-scale model, consisting of an atomistic model in LAMMPS of an InSb nanowire, and a continuum model in COMSOL of a socalled Majorana research device, to study the effects of thermo-mechanical deformations during the cool down from room temperature to the operating temperature of about 50 mK. For the simulation of the InSb nano-wire suitable potentials were implemented in LAMMPS. The simulation results of the nano-wire show size dependent Young's moduli and gradients in the radial lattice spacing during uniaxial straining. The materials properties that were derived from the atomistic model, were introduced in the continuum model. Cool down of the device from room temperature to it's operating temperature introduced significant deformation. However, the stresses in the system are moderate and no fracture or damage is expected. Still, deformation of the device will induce shifts in band gap behavior of the device. Band gap shifts using a simple approximation are estimated to be about 34%.

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Thermo-mechanical effects in majorana type quantum devices

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