Thermo-mechanical effects in majorana type quantum devices

A.W.J. Gielen, F.O. Valega Mackenzie

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Abstract

We have developed a multi-scale model, consisting of an atomistic model in LAMMPS of an InSb nanowire, and a continuum model in COMSOL of a socalled Majorana research device, to study the effects of thermo-mechanical deformations during the cool down from room temperature to the operating temperature of about 50 mK. For the simulation of the InSb nano-wire suitable potentials were implemented in LAMMPS. The simulation results of the nano-wire show size dependent Young's moduli and gradients in the radial lattice spacing during uniaxial straining. The materials properties that were derived from the atomistic model, were introduced in the continuum model. Cool down of the device from room temperature to it's operating temperature introduced significant deformation. However, the stresses in the system are moderate and no fracture or damage is expected. Still, deformation of the device will induce shifts in band gap behavior of the device. Band gap shifts using a simple approximation are estimated to be about 34%.

Original languageEnglish
Title of host publication2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
PublisherInstitute of Electrical and Electronics Engineers
Number of pages9
ISBN (Print)9781479999507
DOIs
Publication statusPublished - 6 May 2015
Event16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015) - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015
Conference number: 16
http://www.eurosime.org/b15.htm

Conference

Conference16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015)
Abbreviated titleEuroSimE 2015
Country/TerritoryHungary
CityBudapest
Period19/04/1522/04/15
Other
Internet address

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