Thermal Stress Reduction and Lifetime Improvement of Power Switches with Dynamic Gate Driving Strategy

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

The thermal stress and lifetime of semiconductor power switches are largely influenced by its current flow profile. Considerable thermal stress and reduced lifetime problems occur especially at low
frequency operation. In this paper, a dynamic gate driver that supplies adjustable voltage is proposed to mitigate thermal stress for lifetime improvement.
Original languageEnglish
Title of host publicationIEEE Young Researchers Symposium in Electrical Power Engineering (YRS 2018)
Place of PublicationBrussels
Publication statusPublished - 24 May 2018
EventIEEE Young Researchers Symposium in Electrical Power Engineering (YRS 2018) - Bruxelles, Belgium
Duration: 24 May 201825 May 2018
http://yrs2018.ulb.be/

Conference

ConferenceIEEE Young Researchers Symposium in Electrical Power Engineering (YRS 2018)
Abbreviated titleYRS2018
Country/TerritoryBelgium
CityBruxelles
Period24/05/1825/05/18
Internet address

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