Thermal flow sensors on flexible substrates for minimally invasive medical instruments

B. Mimoun; A. van der Horst; D. van der Voort; M. Rutten; F.N. van de Vosse; R. Dekker

doi:10.1109/ICSENS.2012.6411429

Thermal flow sensors on flexible substrates for minimally invasive medical instruments

B. Mimoun, A. van der Horst, D. van der Voort, M. Rutten, F.N. van de Vosse, R. Dekker

Cardiovascular Biomechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

18 Citations (Scopus)

Abstract

We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment.

Original language	English
Title of host publication	Proceedings of IEEE Sensors
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	4
ISBN (Print)	9781457717659
DOIs	https://doi.org/10.1109/ICSENS.2012.6411429
Publication status	Published - 2012
Event	11th IEEE Sensors Conference, SENSORS 2012 - Taipei, Taiwan Duration: 28 Oct 2012 → 31 Oct 2012

Conference

Conference	11th IEEE Sensors Conference, SENSORS 2012
Country/Territory	Taiwan
City	Taipei
Period	28/10/12 → 31/10/12

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10.1109/ICSENS.2012.6411429

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title = "Thermal flow sensors on flexible substrates for minimally invasive medical instruments",

abstract = "We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. ",

author = "B. Mimoun and {van der Horst}, A. and {van der Voort}, D. and M. Rutten and {van de Vosse}, F.N. and R. Dekker",

year = "2012",

doi = "10.1109/ICSENS.2012.6411429",

language = "English",

isbn = "9781457717659",

booktitle = "Proceedings of IEEE Sensors",

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note = "11th IEEE Sensors Conference, SENSORS 2012 ; Conference date: 28-10-2012 Through 31-10-2012",

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Mimoun, B, van der Horst, A , van der Voort, D , Rutten, M , van de Vosse, FN & Dekker, R 2012, Thermal flow sensors on flexible substrates for minimally invasive medical instruments. in Proceedings of IEEE Sensors., 6411429, Institute of Electrical and Electronics Engineers, Piscataway, 11th IEEE Sensors Conference, SENSORS 2012, Taipei, Taiwan, 28/10/12. https://doi.org/10.1109/ICSENS.2012.6411429

Thermal flow sensors on flexible substrates for minimally invasive medical instruments. / Mimoun, B.; van der Horst, A.; van der Voort, D. et al.
Proceedings of IEEE Sensors. Piscataway: Institute of Electrical and Electronics Engineers, 2012. 6411429.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Thermal flow sensors on flexible substrates for minimally invasive medical instruments

AU - Mimoun, B.

AU - van der Horst, A.

AU - van der Voort, D.

AU - Rutten, M.

AU - van de Vosse, F.N.

AU - Dekker, R.

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AB - We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment.

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M3 - Conference contribution

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SN - 9781457717659

BT - Proceedings of IEEE Sensors

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 11th IEEE Sensors Conference, SENSORS 2012

Y2 - 28 October 2012 through 31 October 2012

ER -

Thermal flow sensors on flexible substrates for minimally invasive medical instruments

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