Thermal flow sensors on flexible substrates for minimally invasive medical instruments

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

18 Citations (Scopus)


We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages4
ISBN (Print)9781457717659
Publication statusPublished - 2012
Event11th IEEE Sensors Conference, SENSORS 2012 - Taipei, Taiwan
Duration: 28 Oct 201231 Oct 2012


Conference11th IEEE Sensors Conference, SENSORS 2012


Dive into the research topics of 'Thermal flow sensors on flexible substrates for minimally invasive medical instruments'. Together they form a unique fingerprint.

Cite this