Thermal flow sensors on flexible substrates for minimally invasive medical instruments

B. Mimoun, A. van der Horst, D. van der Voort, M. Rutten, F.N. van de Vosse, R. Dekker

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

12 Citations (Scopus)

Abstract

We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages4
ISBN (Print)9781457717659
DOIs
Publication statusPublished - 2012
Event11th IEEE SENSORS 2012 Conference - Taipei, Taiwan
Duration: 28 Oct 201231 Oct 2012

Conference

Conference11th IEEE SENSORS 2012 Conference
CountryTaiwan
CityTaipei
Period28/10/1231/10/12

Fingerprint

Thermopiles
Sensors
Substrates
Electric heating elements
Seebeck coefficient
Catheters
Channel flow
Polyimides
Printed circuit boards
Blood
Wire
Silicon
Hot Temperature
Temperature

Cite this

Mimoun, B., van der Horst, A., van der Voort, D., Rutten, M., van de Vosse, F. N., & Dekker, R. (2012). Thermal flow sensors on flexible substrates for minimally invasive medical instruments. In Proceedings of IEEE Sensors [6411429] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICSENS.2012.6411429
Mimoun, B. ; van der Horst, A. ; van der Voort, D. ; Rutten, M. ; van de Vosse, F.N. ; Dekker, R. / Thermal flow sensors on flexible substrates for minimally invasive medical instruments. Proceedings of IEEE Sensors. Piscataway : Institute of Electrical and Electronics Engineers, 2012.
@inproceedings{42764b3988184493828dbb0657003e0c,
title = "Thermal flow sensors on flexible substrates for minimally invasive medical instruments",
abstract = "We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. ",
author = "B. Mimoun and {van der Horst}, A. and {van der Voort}, D. and M. Rutten and {van de Vosse}, F.N. and R. Dekker",
year = "2012",
doi = "10.1109/ICSENS.2012.6411429",
language = "English",
isbn = "9781457717659",
booktitle = "Proceedings of IEEE Sensors",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",

}

Mimoun, B, van der Horst, A, van der Voort, D, Rutten, M, van de Vosse, FN & Dekker, R 2012, Thermal flow sensors on flexible substrates for minimally invasive medical instruments. in Proceedings of IEEE Sensors., 6411429, Institute of Electrical and Electronics Engineers, Piscataway, 11th IEEE SENSORS 2012 Conference, Taipei, Taiwan, 28/10/12. https://doi.org/10.1109/ICSENS.2012.6411429

Thermal flow sensors on flexible substrates for minimally invasive medical instruments. / Mimoun, B.; van der Horst, A.; van der Voort, D.; Rutten, M.; van de Vosse, F.N.; Dekker, R.

Proceedings of IEEE Sensors. Piscataway : Institute of Electrical and Electronics Engineers, 2012. 6411429.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Thermal flow sensors on flexible substrates for minimally invasive medical instruments

AU - Mimoun, B.

AU - van der Horst, A.

AU - van der Voort, D.

AU - Rutten, M.

AU - van de Vosse, F.N.

AU - Dekker, R.

PY - 2012

Y1 - 2012

N2 - We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

AB - We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

UR - http://www.scopus.com/inward/record.url?scp=84873974557&partnerID=8YFLogxK

U2 - 10.1109/ICSENS.2012.6411429

DO - 10.1109/ICSENS.2012.6411429

M3 - Conference contribution

AN - SCOPUS:84873974557

SN - 9781457717659

BT - Proceedings of IEEE Sensors

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Mimoun B, van der Horst A, van der Voort D, Rutten M, van de Vosse FN, Dekker R. Thermal flow sensors on flexible substrates for minimally invasive medical instruments. In Proceedings of IEEE Sensors. Piscataway: Institute of Electrical and Electronics Engineers. 2012. 6411429 https://doi.org/10.1109/ICSENS.2012.6411429