Thermal crosstalk reduction in InP based photonic integrated circuits

In this paper we numerically investigate the thermal crosstalk reduction that can be obtained by etching deep trenches in Indium Phosphide based photonic integrated circuits. We show how deep trenches between adjacent components inod(j5.’ the heat transfer path. The current injected in active components and the geometly of the trenches are the parameters considered in our analysis. We demonstrate how the geometry of the trenches play a role in the reduction of the thermal crosstalk. The nwnerical results show a reduction of the distance between components up to 50%.