Thermal control in wafer scanners using high complexity models

R.W.H. Merks, M.B.I. Habets, S. Weiland

Research output: Contribution to conferenceOtherAcademic

Abstract

The performance of ASML’s wafer scanners is mainly measured in terms of speed and resolution. The company is therefore aiming at reducing feature sizes on chips, while at the same time increasing machine throughput. As a result error margins become smaller, while both the power and bandwidth of signals increase.

Thermally induced deformations of various components are a significant source of errors in wafer scanners. In practice, low complexity models are used for real time control purposes, because high complexity models are generally not fast enough. These low complexity models have a limited accuracy, which therefore limits the system performance. For this reason the use of high resolution, multiphysics models for control purposes is proposed.

Conference

Conference35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands
CountryNetherlands
CitySoesterberg
Period22/03/1624/03/16
Internet address

Fingerprint

Real time control
Throughput
Bandwidth
Hot Temperature
Industry

Cite this

Merks, R. W. H., Habets, M. B. I., & Weiland, S. (2016). Thermal control in wafer scanners using high complexity models. 35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands, Soesterberg, Netherlands.
Merks, R.W.H. ; Habets, M.B.I. ; Weiland, S./ Thermal control in wafer scanners using high complexity models. 35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands, Soesterberg, Netherlands.1 p.
@conference{49225c3060aa4f08a9a90ac2f6f7e03b,
title = "Thermal control in wafer scanners using high complexity models",
abstract = "The performance of ASML’s wafer scanners is mainly measured in terms of speed and resolution. The company is therefore aiming at reducing feature sizes on chips, while at the same time increasing machine throughput. As a result error margins become smaller, while both the power and bandwidth of signals increase.Thermally induced deformations of various components are a significant source of errors in wafer scanners. In practice, low complexity models are used for real time control purposes, because high complexity models are generally not fast enough. These low complexity models have a limited accuracy, which therefore limits the system performance. For this reason the use of high resolution, multiphysics models for control purposes is proposed.",
author = "R.W.H. Merks and M.B.I. Habets and S. Weiland",
year = "2016",
language = "English",
note = "35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands ; Conference date: 22-03-2016 Through 24-03-2016",
url = "http://www.beneluxmeeting.nl/2016/",

}

Merks, RWH, Habets, MBI & Weiland, S 2016, 'Thermal control in wafer scanners using high complexity models' 35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands, Soesterberg, Netherlands, 22/03/16 - 24/03/16, .

Thermal control in wafer scanners using high complexity models. / Merks, R.W.H.; Habets, M.B.I.; Weiland, S.

2016. 35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands, Soesterberg, Netherlands.

Research output: Contribution to conferenceOtherAcademic

TY - CONF

T1 - Thermal control in wafer scanners using high complexity models

AU - Merks,R.W.H.

AU - Habets,M.B.I.

AU - Weiland,S.

PY - 2016

Y1 - 2016

N2 - The performance of ASML’s wafer scanners is mainly measured in terms of speed and resolution. The company is therefore aiming at reducing feature sizes on chips, while at the same time increasing machine throughput. As a result error margins become smaller, while both the power and bandwidth of signals increase.Thermally induced deformations of various components are a significant source of errors in wafer scanners. In practice, low complexity models are used for real time control purposes, because high complexity models are generally not fast enough. These low complexity models have a limited accuracy, which therefore limits the system performance. For this reason the use of high resolution, multiphysics models for control purposes is proposed.

AB - The performance of ASML’s wafer scanners is mainly measured in terms of speed and resolution. The company is therefore aiming at reducing feature sizes on chips, while at the same time increasing machine throughput. As a result error margins become smaller, while both the power and bandwidth of signals increase.Thermally induced deformations of various components are a significant source of errors in wafer scanners. In practice, low complexity models are used for real time control purposes, because high complexity models are generally not fast enough. These low complexity models have a limited accuracy, which therefore limits the system performance. For this reason the use of high resolution, multiphysics models for control purposes is proposed.

M3 - Other

ER -

Merks RWH, Habets MBI, Weiland S. Thermal control in wafer scanners using high complexity models. 2016. 35th Benelux Meeting on Systems and Control, March 22-24, 2016, Soesterberg, The Netherlands, Soesterberg, Netherlands.