Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

112 Downloads (Pure)

Original language	English
Title of host publication	Proceedings of 23rd European Conference on Integrated Optics
Publisher	Politecnico di Milano
Chapter	W.P.2
Number of pages	3
Publication status	Published - 4 May 2022
Event	23rd European Conference on Integrated Optics (ECIO 2022) - Politecnico di Milano, Milan, Italy Duration: 4 May 2022 → 6 May 2022 Conference number: 23 http://www.ecio-conference.org

Conference	23rd European Conference on Integrated Optics (ECIO 2022)
Abbreviated title	ECIO 2022
Country/Territory	Italy
City	Milan
Period	4/05/22 → 6/05/22
Internet address	http://www.ecio-conference.org

Access to Document

@inproceedings{a7a926a0c60242ef9946f0691b31ab1c,

title = "Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane",

author = "Yi Wang and {van Engelen}, Jorn and Victor Dolores-Calzadilla and Kevin Williams and Meint Smit and Yuqing Jiao",

year = "2022",

month = may,

day = "4",

language = "English",

booktitle = "Proceedings of 23rd European Conference on Integrated Optics",

publisher = "Politecnico di Milano",

note = "23rd European Conference on Integrated Optics (ECIO 2022), ECIO 2022 ; Conference date: 04-05-2022 Through 06-05-2022",

url = "http://www.ecio-conference.org",

}

TY - GEN

T1 - Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane

AU - Wang, Yi

AU - van Engelen, Jorn

AU - Dolores-Calzadilla, Victor

AU - Williams, Kevin

AU - Smit, Meint

AU - Jiao, Yuqing

N1 - Conference code: 23

PY - 2022/5/4

Y1 - 2022/5/4

M3 - Conference contribution

BT - Proceedings of 23rd European Conference on Integrated Optics

PB - Politecnico di Milano

T2 - 23rd European Conference on Integrated Optics (ECIO 2022)

Y2 - 4 May 2022 through 6 May 2022

ER -