The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads

H. Botter; H.L.M. Wijen; A.H. Berg, van den; F. Soetens; IJ.J. Straalen, van; A. Vlot

The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads

H. Botter, H.L.M. Wijen, A.H. Berg, van den, F. Soetens, IJ.J. Straalen, van, A. Vlot

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the 6th International Conference on Structural Adhesives in Engineering
Place of Publication	Bristol UK
Publication status	Published - 2001
Event	conference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06 - Duration: 4 Jul 2001 → 6 Jul 2001

Conference

Conference	conference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06
Period	4/07/01 → 6/07/01
Other	6th International Conference on Structural Adhesives in Engineering

Cite this

@inproceedings{c6d85eb72340438e85db081431178324,

title = "The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads",

author = "H. Botter and H.L.M. Wijen and {Berg, van den}, A.H. and F. Soetens and {Straalen, van}, IJ.J. and A. Vlot",

year = "2001",

language = "English",

booktitle = "Proceedings of the 6th International Conference on Structural Adhesives in Engineering",

note = "conference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06 ; Conference date: 04-07-2001 Through 06-07-2001",

}

Botter, H, Wijen, HLM, Berg, van den, AH, Soetens, F, Straalen, van, IJJ & Vlot, A 2001, The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads. in Proceedings of the 6th International Conference on Structural Adhesives in Engineering. Bristol UK, conference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06, 4/07/01.

The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads. / Botter, H.; Wijen, H.L.M.; Berg, van den, A.H. et al.
Proceedings of the 6th International Conference on Structural Adhesives in Engineering. Bristol UK, 2001.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads

AU - Botter, H.

AU - Wijen, H.L.M.

AU - Berg, van den, A.H.

AU - Soetens, F.

AU - Straalen, van, IJ.J.

AU - Vlot, A.

PY - 2001

Y1 - 2001

M3 - Conference contribution

BT - Proceedings of the 6th International Conference on Structural Adhesives in Engineering

CY - Bristol UK

T2 - conference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06

Y2 - 4 July 2001 through 6 July 2001

ER -