The kinetics of low-temperature spatial atomic layer deposition of aluminum oxide

P. Poodt, A. Illiberi, F. Roozeboom

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)

Abstract

Spatial atomic layer deposition can be used as a high-throughput manufacturing technique in functional thin film deposition for applications such as flexible electronics. This, however, requires low-temperature deposition processes. We have investigated the kinetics of low-temperature (<100 °C) spatial atomic layer deposition of alumina from tri-methyl aluminum and water. The water partial pressure and the exposure time were identified as the critical parameters in this process.
Original languageEnglish
Pages (from-to)22-25
JournalThin Solid Films
Volume532
DOIs
Publication statusPublished - 2013

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