The influence of thermal treatments on the adhesion of electrolessly deposited Ni(P) layers on alumina ceramic

J.W. Severin, R. Hokke, H. Wel, van der, G. With, de

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Abstract

The adhesion of electrolessly deposited Ni(P) on 96 and 99.5% pure alumina was studied as a function of annealing temp., up to 580 DegC. The adhesion was measured with the direct pull-off test and the peel test. The interface structure was analyzed with cross-section transmission electron micrographs. Fracture surfaces were analyzed with SEM/energy dispersive x-ray anal., static-secondary ion mass spectroscopy, and XPS. The optimum annealing temp. was 400 DegC, at which an increase in peel energy and adhesion strength by a factor of 2-3 was measured, with respect to the as-deposited value. The weak boundary layer, which was previously reported to be present in this system, is still present after annealing and the fracture path remains through this interfacial layer of a few nanometers in thickness. Therefore, the adhesion improvement is ascribed to stronger cohesion of the material in the weak boundary layer. [on SciFinder (R)]
Original languageEnglish
Pages (from-to)816-824
JournalJournal of the Electrochemical Society
Volume141
Issue number3
DOIs
Publication statusPublished - 1994

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