Abstract
BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.
Original language | English |
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Title of host publication | ONDM 2011 - 15th Conference on Optical Network Design and Modeling |
Place of Publication | PIscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Number of pages | 5 |
ISBN (Electronic) | 978-3-901882-42-5 |
ISBN (Print) | 978-1-4244-9596-2 |
Publication status | Published - 23 May 2011 |
Event | 15th International Conference on Optical Network Design and Modeling (ONDM 2011) - Bologna, Italy Duration: 8 Feb 2011 → 10 Feb 2011 Conference number: 15 |
Conference
Conference | 15th International Conference on Optical Network Design and Modeling (ONDM 2011) |
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Abbreviated title | ONDM 2011 |
Country/Territory | Italy |
City | Bologna |
Period | 8/02/11 → 10/02/11 |