The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform

C. Stamatiadis; L. Stampoulidis; K. Vyrsokinos; I. Lazarou; L. Zimmermann; K. Voigt; L. Moerl; J. Kreissl; B. Sedighi; Z. Sheng; P. de Heyn; D. van Thourhout; M. Karl; T. Wahlbrink; J. Bolten; A. Leinse; R. Heidemann; F. Gomez-Agis; H. J S Dorren; A. Pagano; E. Riccardi; H. Avramopoulos

The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform

C. Stamatiadis, L. Stampoulidis, K. Vyrsokinos, I. Lazarou, L. Zimmermann, K. Voigt, L. Moerl, J. Kreissl, B. Sedighi, Z. Sheng, P. de Heyn, D. van Thourhout, M. Karl, T. Wahlbrink, J. Bolten, A. Leinse, R. Heidemann, F. Gomez-Agis, H. J S Dorren, A. PaganoE. Riccardi, H. Avramopoulos

Electro-Optical Communication

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

Abstract

BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

Original language	English
Title of host publication	ONDM 2011 - 15th Conference on Optical Network Design and Modeling
Place of Publication	PIscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	5
ISBN (Electronic)	978-3-901882-42-5
ISBN (Print)	978-1-4244-9596-2
Publication status	Published - 23 May 2011
Event	15th International Conference on Optical Network Design and Modeling (ONDM 2011) - Bologna, Italy Duration: 8 Feb 2011 → 10 Feb 2011 Conference number: 15

Conference

Conference	15th International Conference on Optical Network Design and Modeling (ONDM 2011)
Abbreviated title	ONDM 2011
Country/Territory	Italy
City	Bologna
Period	8/02/11 → 10/02/11

Cite this

Stamatiadis, C., Stampoulidis, L., Vyrsokinos, K., Lazarou, I., Zimmermann, L., Voigt, K., Moerl, L., Kreissl, J., Sedighi, B., Sheng, Z., de Heyn, P., van Thourhout, D., Karl, M., Wahlbrink, T., Bolten, J., Leinse, A., Heidemann, R., Gomez-Agis, F., Dorren, H. J. S., ... Avramopoulos, H. (2011). The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform. In ONDM 2011 - 15th Conference on Optical Network Design and Modeling Article 5753413 Institute of Electrical and Electronics Engineers.

@inproceedings{acdacb29069245c8a55de1c11cb1fd53,

title = "The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform",

abstract = "BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.",

author = "C. Stamatiadis and L. Stampoulidis and K. Vyrsokinos and I. Lazarou and L. Zimmermann and K. Voigt and L. Moerl and J. Kreissl and B. Sedighi and Z. Sheng and {de Heyn}, P. and {van Thourhout}, D. and M. Karl and T. Wahlbrink and J. Bolten and A. Leinse and R. Heidemann and F. Gomez-Agis and Dorren, {H. J S} and A. Pagano and E. Riccardi and H. Avramopoulos",

year = "2011",

month = may,

day = "23",

language = "English",

isbn = "978-1-4244-9596-2",

booktitle = "ONDM 2011 - 15th Conference on Optical Network Design and Modeling",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "15th International Conference on Optical Network Design and Modeling (ONDM 2011), ONDM 2011 ; Conference date: 08-02-2011 Through 10-02-2011",

}

Stamatiadis, C, Stampoulidis, L, Vyrsokinos, K, Lazarou, I, Zimmermann, L, Voigt, K, Moerl, L, Kreissl, J, Sedighi, B, Sheng, Z, de Heyn, P, van Thourhout, D, Karl, M, Wahlbrink, T, Bolten, J, Leinse, A, Heidemann, R, Gomez-Agis, F, Dorren, HJS, Pagano, A, Riccardi, E & Avramopoulos, H 2011, The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform. in ONDM 2011 - 15th Conference on Optical Network Design and Modeling., 5753413, Institute of Electrical and Electronics Engineers, PIscataway, 15th International Conference on Optical Network Design and Modeling (ONDM 2011), Bologna, Italy, 8/02/11.

The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform. / Stamatiadis, C.; Stampoulidis, L.; Vyrsokinos, K. et al.
ONDM 2011 - 15th Conference on Optical Network Design and Modeling. PIscataway: Institute of Electrical and Electronics Engineers, 2011. 5753413.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - The ICT-BOOM project

T2 - 15th International Conference on Optical Network Design and Modeling (ONDM 2011)

AU - Stamatiadis, C.

AU - Stampoulidis, L.

AU - Vyrsokinos, K.

AU - Lazarou, I.

AU - Zimmermann, L.

AU - Voigt, K.

AU - Moerl, L.

AU - Kreissl, J.

AU - Sedighi, B.

AU - Sheng, Z.

AU - de Heyn, P.

AU - van Thourhout, D.

AU - Karl, M.

AU - Wahlbrink, T.

AU - Bolten, J.

AU - Leinse, A.

AU - Heidemann, R.

AU - Gomez-Agis, F.

AU - Dorren, H. J S

AU - Pagano, A.

AU - Riccardi, E.

AU - Avramopoulos, H.

N1 - Conference code: 15

PY - 2011/5/23

Y1 - 2011/5/23

N2 - BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

AB - BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

UR - http://www.scopus.com/inward/record.url?scp=79956073945&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:79956073945

SN - 978-1-4244-9596-2

BT - ONDM 2011 - 15th Conference on Optical Network Design and Modeling

PB - Institute of Electrical and Electronics Engineers

CY - PIscataway

Y2 - 8 February 2011 through 10 February 2011

ER -

The ICT-BOOM project: photonic routing on a silicon-on-insulator hybrid platform

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