The Hardware Foundation of 6G: The NEW-6G Approach

Emilio Calvanese Strinati; Michael Peeters; Cesar Roda Neve; Manil Dev Gomony; Andreia Cathelin; Mauro Renato Boldi; Mark Ingels; Aritra Banerjee; Pascal Chevalier; Bartek Kozicki; Didier Belot

doi:10.1109/EuCNC/6GSummit54941.2022.9815700

The Hardware Foundation of 6G: The NEW-6G Approach

Emilio Calvanese Strinati
, Michael Peeters
, Cesar Roda Neve
, Manil Dev Gomony
, Andreia Cathelin
, Mauro Renato Boldi
, Mark Ingels
, Aritra Banerjee
, Pascal Chevalier
, Bartek Kozicki
, Didier Belot

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

21 Citations (Scopus)

Abstract

The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.

Original language	English
Title of host publication	2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022
Publisher	Institute of Electrical and Electronics Engineers
Pages	423-428
Number of pages	6
ISBN (Electronic)	978-1-6654-9871-5
DOIs	https://doi.org/10.1109/EuCNC/6GSummit54941.2022.9815700
Publication status	Published - 8 Jul 2022
Externally published	Yes
Event	2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit - Grenoble, Grenoble, France Duration: 7 Jun 2022 → 10 Jun 2022 https://ieeexplore.ieee.org/xpl/conhome/9815454/proceeding

Conference

Conference	2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit
Abbreviated title	EuCNC
Country/Territory	France
City	Grenoble
Period	7/06/22 → 10/06/22
Internet address	https://ieeexplore.ieee.org/xpl/conhome/9815454/proceeding

Bibliographical note

Funding Information:
ACKNOWLEDGMENTS The authors kindly acknowledge contributions from all relevant colleagues from their respective departments at CEA-LETI, IMEC, STMicroelectronics, Soitec, Nokia Bell Labs and Telecom Italia. We also would like to highlight that this work has been partly funded by the European Commission through the H2020 projects Hexa-X (Grant Agreement no. 101015956) and COREnect (Grant Agreement no. 956830).

Funding

ACKNOWLEDGMENTS The authors kindly acknowledge contributions from all relevant colleagues from their respective departments at CEA-LETI, IMEC, STMicroelectronics, Soitec, Nokia Bell Labs and Telecom Italia. We also would like to highlight that this work has been partly funded by the European Commission through the H2020 projects Hexa-X (Grant Agreement no. 101015956) and COREnect (Grant Agreement no. 956830).

Keywords

5G
6G
AI
BiCMOS
FD-SOI
GaN
hardware
InP
microelectronics

Access to Document

10.1109/EuCNC/6GSummit54941.2022.9815700

Cite this

Strinati, E. C., Peeters, M., Neve, C. R., Gomony, M. D., Cathelin, A., Boldi, M. R., Ingels, M., Banerjee, A., Chevalier, P., Kozicki, B., & Belot, D. (2022). The Hardware Foundation of 6G: The NEW-6G Approach. In 2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022 (pp. 423-428). Article 9815700 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuCNC/6GSummit54941.2022.9815700

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title = "The Hardware Foundation of 6G: The NEW-6G Approach",

abstract = "The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.",

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author = "Strinati, \{Emilio Calvanese\} and Michael Peeters and Neve, \{Cesar Roda\} and Gomony, \{Manil Dev\} and Andreia Cathelin and Boldi, \{Mauro Renato\} and Mark Ingels and Aritra Banerjee and Pascal Chevalier and Bartek Kozicki and Didier Belot",

note = "Funding Information: ACKNOWLEDGMENTS The authors kindly acknowledge contributions from all relevant colleagues from their respective departments at CEA-LETI, IMEC, STMicroelectronics, Soitec, Nokia Bell Labs and Telecom Italia. We also would like to highlight that this work has been partly funded by the European Commission through the H2020 projects Hexa-X (Grant Agreement no. 101015956) and COREnect (Grant Agreement no. 956830). ; 2022 Joint European Conference on Networks and Communications, EuCNC \& 6G Summit, EuCNC ; Conference date: 07-06-2022 Through 10-06-2022",

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Strinati, EC, Peeters, M, Neve, CR, Gomony, MD, Cathelin, A, Boldi, MR, Ingels, M, Banerjee, A, Chevalier, P, Kozicki, B & Belot, D 2022, The Hardware Foundation of 6G: The NEW-6G Approach. in 2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022., 9815700, Institute of Electrical and Electronics Engineers, pp. 423-428, 2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit, Grenoble, France, 7/06/22. https://doi.org/10.1109/EuCNC/6GSummit54941.2022.9815700

The Hardware Foundation of 6G: The NEW-6G Approach. / Strinati, Emilio Calvanese; Peeters, Michael; Neve, Cesar Roda et al.
2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022. Institute of Electrical and Electronics Engineers, 2022. p. 423-428 9815700.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T2 - 2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit

AU - Strinati, Emilio Calvanese

AU - Peeters, Michael

AU - Neve, Cesar Roda

AU - Gomony, Manil Dev

AU - Cathelin, Andreia

AU - Boldi, Mauro Renato

AU - Ingels, Mark

AU - Banerjee, Aritra

AU - Chevalier, Pascal

AU - Kozicki, Bartek

AU - Belot, Didier

N1 - Funding Information: ACKNOWLEDGMENTS The authors kindly acknowledge contributions from all relevant colleagues from their respective departments at CEA-LETI, IMEC, STMicroelectronics, Soitec, Nokia Bell Labs and Telecom Italia. We also would like to highlight that this work has been partly funded by the European Commission through the H2020 projects Hexa-X (Grant Agreement no. 101015956) and COREnect (Grant Agreement no. 956830).

PY - 2022/7/8

Y1 - 2022/7/8

N2 - The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.

AB - The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.

KW - 5G

KW - 6G

KW - AI

KW - BiCMOS

KW - FD-SOI

KW - GaN

KW - hardware

KW - InP

KW - microelectronics

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U2 - 10.1109/EuCNC/6GSummit54941.2022.9815700

DO - 10.1109/EuCNC/6GSummit54941.2022.9815700

M3 - Conference contribution

SP - 423

EP - 428

BT - 2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022

PB - Institute of Electrical and Electronics Engineers

Y2 - 7 June 2022 through 10 June 2022

ER -

The Hardware Foundation of 6G: The NEW-6G Approach

Abstract

Conference

Bibliographical note

Funding

Keywords

Access to Document

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