Abstract
The design of future 6th Generation (6G) wireless connect-compute-control networks requires new approaches for the design of hardware, new materials and hybridization processes new technological solutions, to create a sustainable foundation for the effective operation of innovative services and use cases. In this context, the New-6G initiative focuses on solutions that capitalize on the latest advances in high-performance semiconductor technologies, integrated circuits, digital components, and wide bandwidth radio frequencies. Based on the applications and use cases, we propose two main loci that will have the largest impact: the challenges and opportunities of baseband processing on the one hand and material enablers and related device and circuit challenges on the other hand. For this second part, BiCMOS, FD-SOI, GaN and InP are highlighted as especially of interest. BiCMOS and FD-SOI have already demonstrated their possible application up to 200GHz. While BiCMOS could be potentially used at higher frequencies, III-V (GaN, InP) alternatives when integrated with CMOS could propose cost-effective solution to address higher-power and higher-efficiency sub-THz 6G applications.
Original language | English |
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Title of host publication | 2022 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2022 |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 423-428 |
Number of pages | 6 |
ISBN (Electronic) | 978-1-6654-9871-5 |
DOIs | |
Publication status | Published - 8 Jul 2022 |
Externally published | Yes |
Event | 2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit - Grenoble, Grenoble, France Duration: 7 Jun 2022 → 10 Jun 2022 https://ieeexplore.ieee.org/xpl/conhome/9815454/proceeding |
Conference
Conference | 2022 Joint European Conference on Networks and Communications, EuCNC & 6G Summit |
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Abbreviated title | EuCNC |
Country/Territory | France |
City | Grenoble |
Period | 7/06/22 → 10/06/22 |
Internet address |
Bibliographical note
Funding Information:ACKNOWLEDGMENTS The authors kindly acknowledge contributions from all relevant colleagues from their respective departments at CEA-LETI, IMEC, STMicroelectronics, Soitec, Nokia Bell Labs and Telecom Italia. We also would like to highlight that this work has been partly funded by the European Commission through the H2020 projects Hexa-X (Grant Agreement no. 101015956) and COREnect (Grant Agreement no. 956830).
Keywords
- 5G
- 6G
- AI
- BiCMOS
- FD-SOI
- GaN
- hardware
- InP
- microelectronics