The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

Maria Spyropoulou; Giannis Kanakis; Giorgos Brestas; Yuqing Jiao; Salim Abdi; Zhaowei Chen; Desalegn Feyisa Wolde; Ripalta Stabile; Nicola Calabretta; Kevin Williams; Virginie Nodjiadjim; Romain Hersent; Agnieszka Konczykowska; Muriel Riet; Richard Schatz; Oskars Ozolins; Xiaodan Pang; Mahdieh Joharifar; Jakub Zvěřina; Martin Žoldák; Boaz Atias; Paraskevas Bakopoulos; Elad Mentovich; Hercules Avramopoulos

doi:10.23919/OFC49934.2023.10116407

The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

Maria Spyropoulou, Giannis Kanakis, Giorgos Brestas, Yuqing Jiao, Salim Abdi, Zhaowei Chen, Desalegn Feyisa Wolde, Ripalta Stabile, Nicola Calabretta, Kevin Williams, Virginie Nodjiadjim, Romain Hersent, Agnieszka Konczykowska, Muriel Riet, Richard Schatz, Oskars Ozolins, Xiaodan Pang, Mahdieh Joharifar, Jakub Zvěřina, Martin ŽoldákBoaz Atias, Paraskevas Bakopoulos, Elad Mentovich, Hercules Avramopoulos

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

12 Citations (Scopus)

4 Downloads (Pure)

Abstract

We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.

Original language	English
Title of host publication	2023 Optical Fiber Communications Conference and Exhibition, OFC 2023
Subtitle of host publication	Proceedings
Publisher	Institute of Electrical and Electronics Engineers
Chapter	Tu3I.3
Number of pages	3
ISBN (Electronic)	978-1-957171-18-0
DOIs	https://doi.org/10.23919/OFC49934.2023.10116407
Publication status	Published - 19 May 2023
Event	2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - San Diego, United States Duration: 5 Mar 2023 → 9 Mar 2023

Conference

Conference	2023 Optical Fiber Communications Conference and Exhibition, OFC 2023
Abbreviated title	OFC
Country/Territory	United States
City	San Diego
Period	5/03/23 → 9/03/23

Funding

This work is funded by the H2020 ICT TWILIGHT project (contract No. 781471) under the Photonics PPP.

Access to Document

10.23919/OFC49934.2023.10116407

Cite this

Spyropoulou, M., Kanakis, G., Brestas, G., Jiao, Y., Abdi, S., Chen, Z., Wolde, D. F., Stabile, R., Calabretta, N., Williams, K., Nodjiadjim, V., Hersent, R., Konczykowska, A., Riet, M., Schatz, R., Ozolins, O., Pang, X., Joharifar, M., Zvěřina, J., ... Avramopoulos, H. (2023). The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies. In 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023: Proceedings Article 10116407 Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/OFC49934.2023.10116407

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abstract = "We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.",

author = "Maria Spyropoulou and Giannis Kanakis and Giorgos Brestas and Yuqing Jiao and Salim Abdi and Zhaowei Chen and Wolde, {Desalegn Feyisa} and Ripalta Stabile and Nicola Calabretta and Kevin Williams and Virginie Nodjiadjim and Romain Hersent and Agnieszka Konczykowska and Muriel Riet and Richard Schatz and Oskars Ozolins and Xiaodan Pang and Mahdieh Joharifar and Jakub Zv{\v e}{\v r}ina and Martin {\v Z}old{\'a}k and Boaz Atias and Paraskevas Bakopoulos and Elad Mentovich and Hercules Avramopoulos",

year = "2023",

month = may,

day = "19",

doi = "10.23919/OFC49934.2023.10116407",

language = "English",

booktitle = "2023 Optical Fiber Communications Conference and Exhibition, OFC 2023",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2023 Optical Fiber Communications Conference and Exhibition, OFC 2023, OFC ; Conference date: 05-03-2023 Through 09-03-2023",

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Spyropoulou, M, Kanakis, G, Brestas, G, Jiao, Y , Abdi, S , Chen, Z , Wolde, DF , Stabile, R , Calabretta, N , Williams, K, Nodjiadjim, V, Hersent, R, Konczykowska, A, Riet, M, Schatz, R, Ozolins, O, Pang, X, Joharifar, M, Zvěřina, J, Žoldák, M, Atias, B, Bakopoulos, P, Mentovich, E & Avramopoulos, H 2023, The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies. in 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023: Proceedings., 10116407, Institute of Electrical and Electronics Engineers, 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, United States, 5/03/23. https://doi.org/10.23919/OFC49934.2023.10116407

The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies. / Spyropoulou, Maria; Kanakis, Giannis; Brestas, Giorgos et al.
2023 Optical Fiber Communications Conference and Exhibition, OFC 2023: Proceedings. Institute of Electrical and Electronics Engineers, 2023. 10116407.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

AU - Spyropoulou, Maria

AU - Kanakis, Giannis

AU - Brestas, Giorgos

AU - Jiao, Yuqing

AU - Abdi, Salim

AU - Chen, Zhaowei

AU - Wolde, Desalegn Feyisa

AU - Stabile, Ripalta

AU - Calabretta, Nicola

AU - Williams, Kevin

AU - Nodjiadjim, Virginie

AU - Hersent, Romain

AU - Konczykowska, Agnieszka

AU - Riet, Muriel

AU - Schatz, Richard

AU - Ozolins, Oskars

AU - Pang, Xiaodan

AU - Joharifar, Mahdieh

AU - Zvěřina, Jakub

AU - Žoldák, Martin

AU - Atias, Boaz

AU - Bakopoulos, Paraskevas

AU - Mentovich, Elad

AU - Avramopoulos, Hercules

PY - 2023/5/19

Y1 - 2023/5/19

N2 - We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.

AB - We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.

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DO - 10.23919/OFC49934.2023.10116407

M3 - Conference contribution

AN - SCOPUS:85161287168

BT - 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023

Y2 - 5 March 2023 through 9 March 2023

ER -

Spyropoulou M, Kanakis G, Brestas G, Jiao Y , Abdi S , Chen Z et al. The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies. In 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023: Proceedings. Institute of Electrical and Electronics Engineers. 2023. 10116407 doi: 10.23919/OFC49934.2023.10116407

The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

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