The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate

Amir Abdallah, P.C.P. Bouten, J.M.J. Toonder, den, G. With, de

Research output: Contribution to journalArticleAcademicpeer-review

26 Citations (Scopus)

Abstract

Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.
Original languageEnglish
Pages (from-to)1063-1073
JournalThin Solid Films
Volume516
Issue number6
DOIs
Publication statusPublished - 2008

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