The adhesion of electroless (Ni(P) on alumina ceramic using a vacuum-deposited (Ti-Pd) activator layer

J.W. Severin, R. Hokke, H. Wel, van der, M.T. Johnson, G. With, de

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Abstract

The adhesion of electroless deposited Ni on Al2O3 ceramic substrates using sputtered and evapd. Ti-Pd activator films was studied. The adhesion was measured using the direct pull-off test and the 90 Deg peel test. The morphol. and the chem. compn. of the fracture surfaces of the samples with evapd. Ti-Pd activator film were studied with SEM/energy dispersive x-ray, and static secondary ion mass spectroscopy. Failure did not occur along the metal-ceramic interface, but mainly in the alumina, and therefore the strength of the system is detd. primarily by the substrate material. Cross-sectional transmission electron microscopy and high-resoln. transmission electron microscopy were used to study the interface structure before failure. The oxidn. state of Ti at the interface was measured with XPS. This was carried out in the (sub)monolayer range by using a Ti wedge deposited on alumina with a max. thickness of 0.35 nm. It is concluded that the strong adhesion at the metal-ceramic interface is caused by chem. bonding of the first Ti monolayer with substrate oxygen atoms. [on SciFinder (R)]
Original languageEnglish
Pages (from-to)1611-1616
JournalJournal of the Electrochemical Society
Volume140
Issue number6
DOIs
Publication statusPublished - 1993

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