Abstract
The fabrication ofInP-based Photonic Integrated Circuits (PICs) is a complex process.
The process used in the COBRA cleanroom in Eindhoven consists of 13 deposition, 10
lithography, 14 dry- and 7 wet-etching steps. Together with the intermediate cleaning,
preparation and inspection procedures, the total process flow consists of 243 steps. In
this paper we show how we created a robust modular process flow that can be usedfor
a large variety of active- and passive circuits. These circuits can be fabricated together
in multi-project wafer runs, allowing a drastic reduction of the fabrication costs making
even small-volume production economicallyfeasible.
Original language | English |
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Title of host publication | Proceedings of the 15th Annual Symposium of the IEEE Photonics Benelux Chapter, 18-19 November 2010, Delft, The Netherlands |
Editors | J. Pozo, M. Mortensen, P. Urbach, X. Leijtens, M. Yousefi |
Place of Publication | Delft |
Publisher | TNO |
Pages | 89-92 |
ISBN (Print) | 978-90-78314-15-8 |
Publication status | Published - 2010 |