The 243 steps of making photonic integrated circuits in InP

B. Docter, J. Pozo, T. Vries, de, E.J. Geluk, J. Bolk, E. Smalbrugge, F. Karouta, Y.S. Oei, H.P.M.M. Ambrosius, M.K. Smit

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Abstract

The fabrication ofInP-based Photonic Integrated Circuits (PICs) is a complex process. The process used in the COBRA cleanroom in Eindhoven consists of 13 deposition, 10 lithography, 14 dry- and 7 wet-etching steps. Together with the intermediate cleaning, preparation and inspection procedures, the total process flow consists of 243 steps. In this paper we show how we created a robust modular process flow that can be usedfor a large variety of active- and passive circuits. These circuits can be fabricated together in multi-project wafer runs, allowing a drastic reduction of the fabrication costs making even small-volume production economicallyfeasible.
Original languageEnglish
Title of host publicationProceedings of the 15th Annual Symposium of the IEEE Photonics Benelux Chapter, 18-19 November 2010, Delft, The Netherlands
EditorsJ. Pozo, M. Mortensen, P. Urbach, X. Leijtens, M. Yousefi
Place of PublicationDelft
PublisherTNO
Pages89-92
ISBN (Print)978-90-78314-15-8
Publication statusPublished - 2010

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