Test methods and processes in manufacturing chain of photonic integrated circuits

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
1 Downloads (Pure)

Abstract

Access to fabrication of photonic integrated circuits is enabled via multi-project wafer runs offered by foundries. Such services open a path for proof-of-concept demonstrators and advanced prototypes. However, the technology processes behind those services need extensive developments in order to be scalable and suitable for volume production. Those developments are in a vast part related to test, assembly and packaging across the full PIC manufacturing chain. Standardization and automation of the test methods and equipment is essential for better statistical process control and scalability. When implemented, these will allow for early known-good-die identification, optimization of fabrication process window, improved yield and volume production.The challenges related to PIC testing will be discussed and current developments in our labs towards standardization and automation of test methods from a design phase to system level functional module evaluation will be presented.

Original languageEnglish
Title of host publication2018 20th International Conference on Transparent Optical Networks, ICTON 2018
Place of PublicationPiscataway
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)9781538666043
DOIs
Publication statusPublished - 26 Sep 2018
Event20th International Conference on Transparent Optical Networks, (ICTON2018) - Bucharest, Romania
Duration: 1 Jul 20185 Jul 2018
https://www.itl.waw.pl/en/conferences/icton/299-icton-2018/1505-icton-2018-preliminary-programme

Conference

Conference20th International Conference on Transparent Optical Networks, (ICTON2018)
Abbreviated titleICTON2018
CountryRomania
CityBucharest
Period1/07/185/07/18
Internet address

Fingerprint

Photonics
Standardization
Integrated circuits
Automation
Fabrication
Statistical process control
Foundries
Scalability
Packaging
Testing

Keywords

  • photonic integrated circuits
  • photonic integration
  • test
  • test automation

Cite this

Latkowski, S., Pustakhod, D., Yao, W., Leijtens, X., & Williams, K. (2018). Test methods and processes in manufacturing chain of photonic integrated circuits. In 2018 20th International Conference on Transparent Optical Networks, ICTON 2018 [8473652] Piscataway: IEEE Computer Society. https://doi.org/10.1109/ICTON.2018.8473652
Latkowski, Sylwester ; Pustakhod, Dzmitry ; Yao, Weiming ; Leijtens, Xaveer ; Williams, Kevin. / Test methods and processes in manufacturing chain of photonic integrated circuits. 2018 20th International Conference on Transparent Optical Networks, ICTON 2018. Piscataway : IEEE Computer Society, 2018.
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Latkowski, S, Pustakhod, D, Yao, W, Leijtens, X & Williams, K 2018, Test methods and processes in manufacturing chain of photonic integrated circuits. in 2018 20th International Conference on Transparent Optical Networks, ICTON 2018., 8473652, IEEE Computer Society, Piscataway, 20th International Conference on Transparent Optical Networks, (ICTON2018), Bucharest, Romania, 1/07/18. https://doi.org/10.1109/ICTON.2018.8473652

Test methods and processes in manufacturing chain of photonic integrated circuits. / Latkowski, Sylwester; Pustakhod, Dzmitry; Yao, Weiming; Leijtens, Xaveer; Williams, Kevin.

2018 20th International Conference on Transparent Optical Networks, ICTON 2018. Piscataway : IEEE Computer Society, 2018. 8473652.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Latkowski S, Pustakhod D, Yao W, Leijtens X, Williams K. Test methods and processes in manufacturing chain of photonic integrated circuits. In 2018 20th International Conference on Transparent Optical Networks, ICTON 2018. Piscataway: IEEE Computer Society. 2018. 8473652 https://doi.org/10.1109/ICTON.2018.8473652