| Original language | English |
|---|---|
| Patent number | KR20130006457 |
| IPC | G01R 31/ 3185 A I |
| Priority date | 28/03/11 |
| Publication status | Published - 16 Jan 2013 |
| Externally published | Yes |
Test access architecture for TSV-based 3D stacked ICS
Erik Jan Marinissen (Inventor), J. Verbree (Inventor), M. Konijnenburg (Inventor), C.-C. Chi (Inventor)
Research output: Patent › Patent publication