Original language | English |
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Patent number | KR20130006457 |
IPC | G01R 31/ 3185 A I |
Priority date | 28/03/11 |
Publication status | Published - 16 Jan 2013 |
Externally published | Yes |
Test access architecture for TSV-based 3D stacked ICS
Erik Jan Marinissen (Inventor), J. Verbree (Inventor), M. Konijnenburg (Inventor), C.-C. Chi (Inventor)
Research output: Patent › Patent publication