Test access architecture for TSV-based 3D stacked ICS

Erik Jan Marinissen (Inventor), J. Verbree (Inventor), M. Konijnenburg (Inventor), C.-C. Chi (Inventor)

Research output: PatentPatent publication

Original languageEnglish
Patent numberKR20130006457
IPCG01R 31/ 3185 A I
Priority date28/03/11
Publication statusPublished - 16 Jan 2013
Externally publishedYes

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