Temperature Sensing Diode in InP-Based Photonic Integration Technology

Wenjing Tian (Corresponding author), Bart Bas, Dylan Harmsen, Kevin Williams, Xaveer Leijtens

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3 Citations (Scopus)
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Abstract

The integration of temperature sensors directly onto photonic platforms facilitates the thermal management of advanced photonic integrated circuits. This paper presents monolithic temperature sensors on the indium-phosphide-based photonic integration technology. Two distinct sensors were developed using p-i-n diode junctions with different waveguide core layers, one composed of multiple quantum wells and the other of bulk indium gallium arsenide phosphide. Introducing these sensors to an indium-phosphide-based generic foundry platform required zero process modifications. Theoretical, simulation, and measurement results consistently reveal a linear relationship between the forward voltage of the sensors and temperature under constant current biasing. The measurement results highlight that the compact sensors with dimensions of 30 × 10 μm achieve the highest sensitivity of -2.1 mV/K. These sensors boast a simple structure, easy operation, straightforward temperature interpretation, and high compatibility with the foundry process. They present immunity to on-chip (stray) light, a critical feature when operating alongside integrated lasers. The results demonstrate the feasibility of local temperature measurement and monitoring of photonic integrated circuits.

Original languageEnglish
Article number10460995
Number of pages8
JournalIEEE Photonics Journal
Volume16
Issue number2
DOIs
Publication statusPublished - 2 Apr 2024

Funding

This workwas supported in part by the European Union through Eurostars FLEXFIX Program nr. 2018.29, and in part by Microsoft Research through its Ph.D. Scholarship Programme.

Keywords

  • Diodes
  • photonic integrated circuits
  • temperature sensor
  • thermal management

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