TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany

A. Schmidt; H. Gellersen; E.A.W.H. Hoven, van den; A. Mazalek; P. Holleis; N. Villar

TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany

A. Schmidt (Editor)
, H. Gellersen (Editor)
, E.A.W.H. Hoven, van den (Editor)
, A. Mazalek (Editor)
, P. Holleis (Editor)
, N. Villar (Editor)

Research output: Book/Report › Book editing › Academic › peer-review

Original language	English
Place of Publication	New York
Publisher	Association for Computing Machinery, Inc.
Number of pages	267
ISBN (Print)	978-1-60558-004-3
Publication status	Published - 2008

Cite this

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title = "TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany",

editor = "A. Schmidt and H. Gellersen and \{Hoven, van den\}, E.A.W.H. and A. Mazalek and P. Holleis and N. Villar",

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language = "English",

isbn = "978-1-60558-004-3",

publisher = "Association for Computing Machinery, Inc.",

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A2 - Schmidt, A.

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A2 - Hoven, van den, E.A.W.H.

A2 - Mazalek, A.

A2 - Holleis, P.

A2 - Villar, N.

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PB - Association for Computing Machinery, Inc.

CY - New York

ER -

TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany

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