| Original language | English |
|---|---|
| Place of Publication | New York |
| Publisher | Association for Computing Machinery, Inc |
| Number of pages | 267 |
| ISBN (Print) | 978-1-60558-004-3 |
| Publication status | Published - 2008 |
TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany
A. Schmidt (Editor), H. Gellersen (Editor), E.A.W.H. Hoven, van den (Editor), A. Mazalek (Editor), P. Holleis (Editor), N. Villar (Editor)
Research output: Book/Report › Book editing › Academic › peer-review