TEI goes on : tangible and embedded interaction

E. Hornecker, R.J.K. Jacob, C.C.M. Hummels, B. Ullmer, A. Schmidt, E.A.W.H. Hoven, van den, A. Mazalek

    Research output: Contribution to journalArticleAcademicpeer-review

    34 Citations (SciVal)
    4 Downloads (Pure)

    Abstract

    The first article reports on context-sensitive augmented-reality research presented at the 2007 International Symposium on Ubiquitous Virtual Reality. This student-organized event explored the use of contextual information, design principles, and effective user evaluation for developing AR applications for ubiquitous computing environments. The second article reports on The International Conference on Tangible and Embedded Interaction, the first conference series worldwide to focus on tangible and embedded interaction. The conference is interdisciplinary, covering the arts, hardware design, software toolkits for prototyping, and user studies and theory development.

    Original languageEnglish
    Article number4487094
    Pages (from-to)91-96
    JournalIEEE Pervasive Computing
    Volume7
    Issue number2
    DOIs
    Publication statusPublished - 1 Apr 2008
    Event2nd International Conference on Tangible and Embedded Interaction (TEI 2008) - Bonn, Germany
    Duration: 18 Feb 200820 Feb 2008
    Conference number: 2
    http://www.tei-conf.org/08/

    Keywords

    • Augmented reality
    • Conference
    • Embedded
    • Tangible
    • TUI
    • Ubiquitous computing
    • Ubiquitous virtual reality
    • Virtual reality

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