TEI 2020 Chairs' Welcome

Elise Van Den Hoven; Orit Shaer; Lian Loke; Jelle van Dijk; Andrew Kun

doi:10.1145/3374920

TEI 2020 Chairs' Welcome

Elise Van Den Hoven
, Orit Shaer
, Lian Loke
, Jelle van Dijk
, Andrew Kun

Research output: Chapter in Book/Report/Conference proceeding › Foreword/editorial › Academic

Original language	English
Title of host publication	TEI 2020
Subtitle of host publication	Proceedings of the 14th International Conference on Tangible, Embedded, and Embodied Interaction
Publisher	Association for Computing Machinery, Inc.
Pages	III-IV
Number of pages	2
ISBN (Print)	978-145036107-1
DOIs	https://doi.org/10.1145/3374920
Publication status	Published - 6 Feb 2020
Event	14th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2020 - University of Technology Sydney and University of Sydney, Sydney, Australia Duration: 9 Feb 2020 → 12 Feb 2020 Conference number: 14 https://tei.acm.org/2020/

Conference

Conference	14th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2020
Abbreviated title	TEI 2020
Country/Territory	Australia
City	Sydney
Period	9/02/20 → 12/02/20
Internet address	https://tei.acm.org/2020/

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10.1145/3374920

Cite this

@inbook{df31b988fc654dadb50ddd843ce609d6,

title = "TEI 2020 Chairs' Welcome",

author = "\{Van Den Hoven\}, Elise and Orit Shaer and Lian Loke and \{van Dijk\}, Jelle and Andrew Kun",

year = "2020",

month = feb,

day = "6",

doi = "10.1145/3374920",

language = "English",

isbn = "978-145036107-1",

pages = "III--IV",

booktitle = "TEI 2020",

publisher = "Association for Computing Machinery, Inc.",

address = "United States",

note = "14th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2020, TEI 2020 ; Conference date: 09-02-2020 Through 12-02-2020",

url = "https://tei.acm.org/2020/",

}

Van Den Hoven, E, Shaer, O, Loke, L, van Dijk, J & Kun, A 2020, TEI 2020 Chairs' Welcome. in TEI 2020: Proceedings of the 14th International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, Inc., pp. III-IV, 14th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2020, Sydney, New South Wales, Australia, 9/02/20. https://doi.org/10.1145/3374920

TY - CHAP

T1 - TEI 2020 Chairs' Welcome

AU - Van Den Hoven, Elise

AU - Shaer, Orit

AU - Loke, Lian

AU - van Dijk, Jelle

AU - Kun, Andrew

N1 - Conference code: 14

PY - 2020/2/6

Y1 - 2020/2/6

UR - https://www.scopus.com/pages/publications/85084712137

U2 - 10.1145/3374920

DO - 10.1145/3374920

M3 - Foreword/editorial

AN - SCOPUS:85084712137

SN - 978-145036107-1

SP - III-IV

BT - TEI 2020

PB - Association for Computing Machinery, Inc.

T2 - 14th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2020

Y2 - 9 February 2020 through 12 February 2020

ER -

TEI 2020 Chairs' Welcome

Conference

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