Abstract
This work presents the outcome of a year-long project, part of the Design and Technology of Instrumentation program of the Professional Doctorate in Engineering degree.
The aim of this project was to demonstrate the feasibility of Photonic Integrated Circuit (PIC) device for strain and temperature sensing without the use of a temperature control unit in the main interrogation package. This is done as a first step towards the development of a miniature low-cost Fiber Bragg Grating (FBG) interrogation device, an alternative to one of the main products of Technobis - the Gator.
Such a product is of high interest to companies and organizations in the medical, industrial, aeronautical and automotive fields. The motivation can be found in the quest of companies to implement ever decreasing in size and cost components in their systems.
The problem was approached in several phases, following a test plan to evaluate the feasibility of each building block of the proposed solutions. New packages with optimized low-cost designs were build, tested and analyzed. The outcome of this project gives an indication about the feasibility and stability of these optimized packages without a thermal control.
The aim of this project was to demonstrate the feasibility of Photonic Integrated Circuit (PIC) device for strain and temperature sensing without the use of a temperature control unit in the main interrogation package. This is done as a first step towards the development of a miniature low-cost Fiber Bragg Grating (FBG) interrogation device, an alternative to one of the main products of Technobis - the Gator.
Such a product is of high interest to companies and organizations in the medical, industrial, aeronautical and automotive fields. The motivation can be found in the quest of companies to implement ever decreasing in size and cost components in their systems.
The problem was approached in several phases, following a test plan to evaluate the feasibility of each building block of the proposed solutions. New packages with optimized low-cost designs were build, tested and analyzed. The outcome of this project gives an indication about the feasibility and stability of these optimized packages without a thermal control.
Original language | English |
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Award date | 25 Mar 2020 |
Place of Publication | Eindhoven |
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Publication status | Published - 25 Mar 2020 |