@inproceedings{fc264842acaa4b8f9e9cf7cd32085d1a,
title = "Systems-in-foil - Devices, Fabrication processes and reliability issues",
abstract = "Systems-in-foil are a new class of electronics in which a full system is integrated into a flexible end product. In this paper, we discuss current research activities and state-of-the-art in this field. Furthermore, some of the associated and expected reliability issues will be addressed on the basis of three examples. As a first example we discuss a flexible large area polymeric organic light-emitting (OLED) device. The reliability targets of these devices require protection against the detrimental influence of water. As a second example, we describe a technology for embedding thinned Si chips between polymeric foils where a careful selection of the base materials is important to account for thermal expansion differences. Finally, as a third example, a novel technology for embedding conductive circuitry in a polymeric foil is discussed in which a good matching of the elastic moduli of the polymeric foil and the embedded circuitry is crucial for the flexibility robustness.",
author = "\{Brand, van den\}, J. and \{Baets, de\}, J. and \{Mol, van\}, A.M.B. and A.H. Dietzel",
year = "2008",
doi = "10.1016/j.microrel.2008.06.030",
language = "English",
series = "Microelectronics Reliability",
publisher = "Elsevier",
number = "8-9",
pages = "1123--1128",
editor = "A. Wymystowski",
booktitle = "19th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2008), Maastricht, 29 September - 02 October 2009",
address = "Netherlands",
note = "19th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2008), September 29-October 2, 2009, Maastricht, The Netherlands, ESREF 2008 ; Conference date: 29-09-2008 Through 02-10-2009",
}