Swelling-driven crack propagation in large deformation in ionized hydrogel

Jingqian Ding, Ernst W. Remij, Joris J.C. Remmers, Jacques M. Huyghe

Research output: Contribution to journalArticleAcademicpeer-review

3 Citations (Scopus)

Abstract

Stepwise crack propagation is evidently observed in experiments both in geomaterials and in hydrogels. Pizzocolo et al. (2012, "Mode I Crack Propagation in Hydrogels is Step Wise," Eng. Fract. Mech., 97(1), pp. 72-79) show experimental evidence that mode I crack propagation in hydrogel is stepwise. The pattern of the intermittent crack growth is influenced by many factors, such as porosity of the material, the permeability of the fluid, the stiffness of the material, etc. The pause duration time is negatively correlated with the stiffness of the material, while the average propagation length per step is positively correlated. In this paper, we integrate extended finite element method (XFEM) and enhanced local pressure (ELP) method, and incorporate cohesive relation to reproduce the experiments of Pizzocolo et al. in the finite deformation regime. We investigate the stepwise phenomenon in air and in water, respectively, under mode I fracture. Our simulations show that despite the homogeneous material properties, the crack growth under mode I fracture is stepwise, and this pattern is influenced by the hydraulic permeability and the porosity of the material. Simulated pause duration is negatively correlated with stiffness, and the average propagating length is positively correlated with stiffness. In order to eliminate the numerical artifacts, we also take different time increments into consideration. The staccato propagation does not disappear with smaller time increments, and the pattern is approximately insensitive to the time increment. However, we do not observe stepwise crack growth scheme when we simulate fracture in homogeneous rocks.

Original languageEnglish
Article number101011
Number of pages7
JournalJournal of Applied Mechanics : Transactions of the ASME
Volume85
Issue number10
DOIs
Publication statusPublished - 1 Oct 2018

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