Abstract
The overgrowth of an In2O3 layer by a µc-Si:H layer, deposited by means of plasma-enhanced chemical vapour deposition, will inflict the reduction of the In2O3. AES is combination with Ar+ depth profiling is used for the study of the interfacial deterioration that takes place. The results of a factor analysis study after reduction of the In2O3 are presented.
Original language | English |
---|---|
Pages (from-to) | 628-634 |
Journal | Surface and Interface Analysis |
Volume | 17 |
Issue number | 9 |
DOIs | |
Publication status | Published - 1991 |