Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates

Salim Abdi; Aleksandr Zozulia; Jeroen Bolk; Erik Jan Geluk; Kevin A. Williams; Yuqing Jiao

doi:10.23919/EMPC55870.2023.10418368

Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates

Salim Abdi, Aleksandr Zozulia, Jeroen Bolk, Erik Jan Geluk, Kevin A. Williams, Yuqing Jiao

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

3 Citations (Scopus)

4 Downloads (Pure)

Abstract

Electron Beam Lithography (EBL) metrology and least-square estimation of wafer-scale distortions is used to determine InP membrane deformation as a result of bonding to different substrate materials. First, the accuracy of EBL as a metrology tool for this particular application was assessed. Next, modelling of distortions was tested on unbonded InP wafers as a reference for extracting post-bonding distortions. Then we investigated the effect of substrate material choice on InP membrane deformation after bonding. We found residual expansion factors of 4.53±1, 312.4±1, and 317±1 ppm of the InP membrane bonded to InP, Si, and 3C-SiC carriers, respectively. For the SiO 2 carrier, the 3inch InP membrane split into smaller membranes to reduce the stress, highlighting the importance of substrate choice.

Original language	English
Title of host publication	2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	5
ISBN (Electronic)	978-0-9568086-9-1
DOIs	https://doi.org/10.23919/EMPC55870.2023.10418368
Publication status	Published - 9 Feb 2024
Event	24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023 - Cambridge, United Kingdom Duration: 11 Sept 2023 → 14 Sept 2023

Conference

Conference	24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023
Abbreviated title	EMPC 2023
Country/Territory	United Kingdom
City	Cambridge
Period	11/09/23 → 14/09/23

Keywords

3D integration
Adhesive bonding
heterogeneous integration
metrology
overlay lithography

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10.23919/EMPC55870.2023.10418368

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Abdi, S., Zozulia, A., Bolk, J., Geluk, E. J., Williams, K. A., & Jiao, Y. (2024). Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates. In 2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023 Article 10418368 Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/EMPC55870.2023.10418368

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title = "Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates",

abstract = "Electron Beam Lithography (EBL) metrology and least-square estimation of wafer-scale distortions is used to determine InP membrane deformation as a result of bonding to different substrate materials. First, the accuracy of EBL as a metrology tool for this particular application was assessed. Next, modelling of distortions was tested on unbonded InP wafers as a reference for extracting post-bonding distortions. Then we investigated the effect of substrate material choice on InP membrane deformation after bonding. We found residual expansion factors of 4.53±1, 312.4±1, and 317±1 ppm of the InP membrane bonded to InP, Si, and 3C-SiC carriers, respectively. For the SiO 2 carrier, the 3inch InP membrane split into smaller membranes to reduce the stress, highlighting the importance of substrate choice.",

keywords = "3D integration, Adhesive bonding, heterogeneous integration, metrology, overlay lithography",

author = "Salim Abdi and Aleksandr Zozulia and Jeroen Bolk and Geluk, {Erik Jan} and Williams, {Kevin A.} and Yuqing Jiao",

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booktitle = "2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023",

publisher = "Institute of Electrical and Electronics Engineers",

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Abdi, S , Zozulia, A , Bolk, J, Geluk, EJ, Williams, KA & Jiao, Y 2024, Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates. in 2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023., 10418368, Institute of Electrical and Electronics Engineers, 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023, Cambridge, United Kingdom, 11/09/23. https://doi.org/10.23919/EMPC55870.2023.10418368

Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates. / Abdi, Salim ; Zozulia, Aleksandr ; Bolk, Jeroen et al.
2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023. Institute of Electrical and Electronics Engineers, 2024. 10418368.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates

AU - Abdi, Salim

AU - Zozulia, Aleksandr

AU - Bolk, Jeroen

AU - Geluk, Erik Jan

AU - Williams, Kevin A.

AU - Jiao, Yuqing

PY - 2024/2/9

Y1 - 2024/2/9

N2 - Electron Beam Lithography (EBL) metrology and least-square estimation of wafer-scale distortions is used to determine InP membrane deformation as a result of bonding to different substrate materials. First, the accuracy of EBL as a metrology tool for this particular application was assessed. Next, modelling of distortions was tested on unbonded InP wafers as a reference for extracting post-bonding distortions. Then we investigated the effect of substrate material choice on InP membrane deformation after bonding. We found residual expansion factors of 4.53±1, 312.4±1, and 317±1 ppm of the InP membrane bonded to InP, Si, and 3C-SiC carriers, respectively. For the SiO 2 carrier, the 3inch InP membrane split into smaller membranes to reduce the stress, highlighting the importance of substrate choice.

AB - Electron Beam Lithography (EBL) metrology and least-square estimation of wafer-scale distortions is used to determine InP membrane deformation as a result of bonding to different substrate materials. First, the accuracy of EBL as a metrology tool for this particular application was assessed. Next, modelling of distortions was tested on unbonded InP wafers as a reference for extracting post-bonding distortions. Then we investigated the effect of substrate material choice on InP membrane deformation after bonding. We found residual expansion factors of 4.53±1, 312.4±1, and 317±1 ppm of the InP membrane bonded to InP, Si, and 3C-SiC carriers, respectively. For the SiO 2 carrier, the 3inch InP membrane split into smaller membranes to reduce the stress, highlighting the importance of substrate choice.

KW - 3D integration

KW - Adhesive bonding

KW - heterogeneous integration

KW - metrology

KW - overlay lithography

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U2 - 10.23919/EMPC55870.2023.10418368

DO - 10.23919/EMPC55870.2023.10418368

M3 - Conference contribution

BT - 2023 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023

Y2 - 11 September 2023 through 14 September 2023

ER -

Study of Spatial Distortion in InP Nanophotonic Membranes on Different Carrier Substrates

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