Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul; Alhassan Aljarosha; A.B. Smolders; M.K. Matters-Kammerer; Rob Maaskant

doi:10.1109/EuMIC48047.2021.00066

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul, Alhassan Aljarosha, A.B. Smolders, M.K. Matters-Kammerer, Rob Maaskant

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

3 Downloads (Pure)

Abstract

In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

Original language	English
Title of host publication	2020 15th European Microwave Integrated Circuits Conference (EuMIC)
Publisher	Institute of Electrical and Electronics Engineers
Pages	217-220
Number of pages	4
ISBN (Electronic)	978-2-87487-060-6
ISBN (Print)	978-1-7281-7040-4
DOIs	https://doi.org/10.1109/EuMIC48047.2021.00066
Publication status	Published - 3 Feb 2021
Event	15th European Microwave Integrated Circuits Conference (EuMIC 2020) - Utrecht, Netherlands Duration: 11 Jan 2021 → 15 Jan 2021 Conference number: 15

Conference

Conference	15th European Microwave Integrated Circuits Conference (EuMIC 2020)
Abbreviated title	EuMIC 2020
Country/Territory	Netherlands
City	Utrecht
Period	11/01/21 → 15/01/21

Keywords

Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization
impedance matching
waveguide transitions
Co-design
system integration
millimeter-wave integrated circuits
power amplifiers
spatial power combiners

Access to Document

10.1109/EuMIC48047.2021.00066

Cite this

Kaul, P., Aljarosha, A., Smolders, A. B., Matters-Kammerer, M. K., & Maaskant, R. (2021). Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. In 2020 15th European Microwave Integrated Circuits Conference (EuMIC) (pp. 217-220). Article 9337459 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuMIC48047.2021.00066

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title = "Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition",

abstract = "In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.",

keywords = "Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization, impedance matching, waveguide transitions, Co-design, system integration, millimeter-wave integrated circuits, power amplifiers, spatial power combiners",

author = "Piyush Kaul and Alhassan Aljarosha and A.B. Smolders and M.K. Matters-Kammerer and Rob Maaskant",

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doi = "10.1109/EuMIC48047.2021.00066",

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Kaul, P , Aljarosha, A , Smolders, AB , Matters-Kammerer, MK & Maaskant, R 2021, Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. in 2020 15th European Microwave Integrated Circuits Conference (EuMIC)., 9337459, Institute of Electrical and Electronics Engineers, pp. 217-220, 15th European Microwave Integrated Circuits Conference (EuMIC 2020), Utrecht, Netherlands, 11/01/21. https://doi.org/10.1109/EuMIC48047.2021.00066

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. / Kaul, Piyush ; Aljarosha, Alhassan ; Smolders, A.B. et al.
2020 15th European Microwave Integrated Circuits Conference (EuMIC). Institute of Electrical and Electronics Engineers, 2021. p. 217-220 9337459.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Kaul, Piyush

AU - Aljarosha, Alhassan

AU - Smolders, A.B.

AU - Matters-Kammerer, M.K.

AU - Maaskant, Rob

N1 - Conference code: 15

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N2 - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

AB - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

KW - Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization

KW - impedance matching

KW - waveguide transitions

KW - Co-design

KW - system integration

KW - millimeter-wave integrated circuits

KW - power amplifiers

KW - spatial power combiners

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M3 - Conference contribution

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BT - 2020 15th European Microwave Integrated Circuits Conference (EuMIC)

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ER -

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

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