Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

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Abstract

In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.
Original languageEnglish
Title of host publication2020 15th European Microwave Integrated Circuits Conference (EuMIC)
PublisherInstitute of Electrical and Electronics Engineers
Pages217-220
Number of pages4
ISBN (Electronic)978-2-87487-060-6
ISBN (Print)978-1-7281-7040-4
DOIs
Publication statusPublished - 3 Feb 2021
Event15th European Microwave Integrated Circuits Conference (EuMIC 2020) - Utrecht, Netherlands
Duration: 11 Jan 202115 Jan 2021
Conference number: 15

Conference

Conference15th European Microwave Integrated Circuits Conference (EuMIC 2020)
Abbreviated titleEuMIC 2020
Country/TerritoryNetherlands
CityUtrecht
Period11/01/2115/01/21

Keywords

  • Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization
  • impedance matching
  • waveguide transitions
  • Co-design
  • system integration
  • millimeter-wave integrated circuits
  • power amplifiers
  • spatial power combiners

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