In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.
|Title of host publication||2020 15th European Microwave Integrated Circuits Conference (EuMIC)|
|Place of Publication||Utrecht, The Netherlands|
|Publisher||Institute of Electrical and Electronics Engineers|
|Publication status||Published - 3 Feb 2021|
- Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization