Spatial Atomic Layer Deposition for large-area and flexible electronics

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Large-area and flexible electronics could potentially benefit tremendously from the advantages of ALD over other deposition techniques. These applications, however, require deposition on large areas and on flexible substrates at deposition rates unattainable with conventional ALD. For this purpose, spatial ALD has been developed, which relies on spatial instead of temporal separation of precursor exposures. In this article, the pivotal role of the Dutch spatial ALD community is highlighted, and several examples of current challenges in spatial ALD are discussed.
Original languageEnglish
Pages (from-to)29-31
JournalNevac Blad
Issue number2
Publication statusPublished - 2 Jun 2020


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